Continual scaling of the CMOS technology requires thinner gate dielectric to maintain high performance. However, when moving into the sub-45 nm CMOS generation, the traditional poly-Si gate approach cannot effectively reduce the gate thickness further due to the poly-depletion effect. Fully silicided Ni metal gate (FUSI) has been proven to be a promising solution. Ni FUSI metal gate can signifi...

The polycrystalline nature of the metal gate and the corresponding non-uniformity in the gate workfunction results in statistical variability in MOSFETs with high-!/metal gate stacks. Here the impact of the workfunction variation (WFV) associated with different gate grain orientations on the threshold voltage variation in a test bed 35 nm nMOSFETs is studied in details using full scale 3D numer...

The influence of metal-oxide interactions on the workfunction and band alignment in thin oxide films is investigated for silica mono- and bilayers grown on Mo(112) and Ru(0001) supports. By analyzing the position of field-emission resonances and the Kelvin-probe signal deduced from conductance and force spectroscopy, we have identified a substantial lowering of the workfunction in the monolayer...

The standard polaron band model of doped organic semiconductors predicts that density-of-states shift into the π-π* gap to give a partially filled polaron band that pins the Fermi level. This picture neglects both Madelung and Hubbard interactions. Here we show using ultrahigh workfunction hole-doped model triarylamine-fluorene copolymers that Hubbard interaction strongly splits the singly-occu...

Conventionally polysilicon is used in MOSFETs for gate material. Doping of polysilicon and thus changing the workfunction is carried out to change the threshold voltage. Additionally polysilicon is not favourable as gate material for smaller dimensional devices because of its high thermal budget process and degradation due to the depletion of the doped polysilicon, thus metal gate is preferred ...

Leakage current reduction is of primary importance as the technology scaling trends continue towards deep sub-micrometer regime. One of the leakage mechanisms which contribute significantly to power dissipation is the Gate Induced Drain Leakage (GIDL). GIDL sets an upper limit on the VLSI MOSFET scaling and may even lead to device breakdown. Thus, in order to improve performance, static power c...

The semiconducting single-walled carbon nanotube (C-SWNT) has been synthesized by S-doping, and they have extensive potential application in electronic devices. We investigated the electronic structures of S-doped capped (5, 5) C-SWNT with different doping position using first principles calculations. It is found that the electronic structures influence strongly on the workfunction without and ...

The paper reviews our recent progress and current challenges in implementing advanced gate stacks composed of high-j dielectric materials and metal gates in mainstream Si CMOS technology. In particular, we address stacks of doped polySi gate electrodes on ultrathin layers of high-j dielectrics, dual-workfunction metal-gate technology, and fully silicided gates. Materials and device characteriza...

Results are presented on the performance of a heterojunction interfacial workfunction internal photoemission ~HEIWIP! wavelength-tailorable detector. The detection mechanism is based on free-carrier absorption in the heavily doped emitter regions and internal emission across a workfunction barrier caused by the band gap offset at the heterojunction. The HEIWIP detectors have the high responsivi...