نتایج جستجو برای: technology packages

تعداد نتایج: 482596  

Journal: :international journal of agricultural science, research and technology in extension and education systems 2014
nwaobiala . chioma udo

the poor performance of fishery subsector is most clearly evidenced by low adoption of fishery production technologies by farmers. the purpose of this research was analyzing influence of socio-economic factors on the adoption of fish production technologies by community-based farmers in cross river state, nigeria. a multistage random sampling technique was used in selecting 60 community-based f...

Chioma Udo Nwaobiala .

The poor performance of fishery subsector is most clearly evidenced by low adoption of fishery production technologies by farmers. The purpose of this research was analyzing influence of socio-economic factors on the adoption of fish production technologies by community-based farmers in Cross River State, Nigeria. A Multistage random sampling technique was used in selecting 60 community-based f...

Journal: :international journal of agricultural science, research and technology in extension and education systems 2014
nwaobiala . chioma udo

beekeeping as a technology package disseminated to target farmers in nigeria seems to suffer setbacks ranging from negative perception of farmers about the technology to technical contents of the package. this study therefore analyzes the technology attributes that influence non adoption of apiary technology packages in cross river state, nigeria. purposive and multistage random sampling techni...

Chioma Udo Nwaobiala .

    Beekeeping as a technology package disseminated to target farmers in Nigeria seems to suffer setbacks ranging from negative perception of farmers about the technology to technical contents of the package. This study therefore analyzes the technology attributes that influence non adoption of apiary technology packages in Cross River State, Nigeria. Purposive and multist...

2002
Yoshikazu Nakamura

The continuing demand for yet smaller and lighter electronic devices requires micro packaging where shrinkage in the geometry of the substrates as well as decrease of the area of the die is needed. Higher device and circuitry integration of the silicon die, finer pitch of fully populated arrays interconnections are examples of how the industry is meeting these miniaturizations demand. Today tec...

2016
S. Manjit Sidhu

This chapter presents the development of technology-assisted problem solving (TAPS) packages at University Tenaga Nasional (UNITEN). This project is the further work of the development of interactive multimedia-based packages targeted for students having problems in understanding the subject of engineering mechanics dynamics. One facet of the project is the development of engineering mechanics ...

Journal: :Journal of Japan Institute of Electronics Packaging 1998

Journal: :Proceedings of the ... International Symposium on Microelectronics 2021

Abstract In recent years, as electronic devices such smartphones become more functional, compact, and lower cost, many semiconductor makers are studying the packages WLP (Wafer Level Package) having re-distribution layer (RDL).With miniaturization increase in number of pins a package, method conduction between chip an external electrode has been changed from wire connection to bump RDL. And app...

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