We present here the findings of Alpha’s Alloy Development Program on the next generation of low temperature alloys that can be used in reflow soldering temperatures from 170 to 200C. Approaches in alloy development, test methodologies and results are discussed. The alloy properties targeted for improvements include: Alloy strength, alloy ductility, microstructure stability, improvements in ther...

Today’s wave soldering processes solder electronic assemblies within the large eutectic tin lead processing window. The issues surrounding the conversion to lead free assembly are multiple and varied. Logistics, cost, material selection, and equipment choices/options are some of these challenges that require planning and organization. However, at the core of lead free assembly is soldering. The...

PURPOSE The present study was intended to evaluate the effect of soldering techniques with infrared ray and gas torch under different gap distances (0.3 mm and 0.5 mm) on the tensile strength and surface porosity formation in Ni-Cr base metal alloy. MATERIALS AND METHODS Thirty five dumbbell shaped Ni-Cr alloy specimens were prepared and assigned to 5 groups according to the soldering method ...

Background: Different soldering techniques have a variety of applications in dentistry. One of the most important uses of soldering is to join multiple-unit fixed partial dentures together. In this Study, two base metal alloys (Supercast and Minalux) were soldered  and their tensile, compressive and flexural strengths were measured and compared to each other. Materials and methods: In this ...

While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable ...

There has been major interest in Lead-free soldering within the electronics assembly industry for the last several years, and this will continue with the agreement on the language and implementation dates of the WEEE/ROHS legislation in the EU. This paper will focus on several topics critical to the implementation of lead-free soldering. These topics include the impact of Tin-silver-copper as t...

STATEMENT OF PROBLEM It is not known whether different high-palladium alloys of similar composition possess comparable tensile strength properties associated with connector soldering. PURPOSE The purpose of this study was to evaluate the tensile strength properties of 2 high-palladium alloys on soldered connectors under simulated pre-ceramic and post-ceramic soldering conditions. MATERIAL A...