introduction: knee orthosis is used in different cases and can be seen pistoning movement in all orthosis. the purpose of this study was to evaluate the effects of increasing mass knee brace and two kinds of silicon and polyethylene (pe) pad on pistoning movement during walking, on health subject. material and methods: a total of 20 healthy volunteers, including 10 men and 10 women, with an ave...

Silicon wafers are used as substrates to build more than 90% of integrated circuits. One of the manufacturing processes for silicon wafers is grinding. This paper reports the investigations of silicon wafer grinding using Finite Element Analysis (FEA). FEA models are first used to study the effects of process parameters on waviness reduction in the grinding of wire-sawn wafers on a rigid chuck....

The Backward Silicon Tracker of the H1 experiment is being used in conjunction with a lead-fiber Calorimeter for detailed investigations of inclusive deeply inelastic scattering of leptons from protons, e±P → e±X, and of charm production at small values of the Bjorken variable x, x ≤ 10−3. In this thesis the development of a trigger for the Backward Silicon Tracker is described. The detector wa...

The tarsi of the cricket Tettigonia viridissima bear flexible attachment pads that are able to deform, replicating the profile of a surface to which they are apposed. This attachment system is supplemented by a secretion produced by epidermal cells and transported onto the surface of the pad through the pore canals of the pad cuticle. This study shows that the secretion alone is necessary, but ...

Silicon wafers are the primary semiconductor substrates used to fabricate Integrated Circuits (ICs). Recently, the industry is making a transition from 200 to 300 mm wafers. To attain very flat 300 mm silicon wafers, grinding has been used to flatten the wire-sawn wafers. However, it is challenging for grinding to remove the waviness induced in wire sawing. To enhance the waviness removal abili...

Intense x-ray sources coupled with efficient, high-speed x-ray imagers are opening new possibilities of high-speed time resolved experiments. The silicon pixel array detector ~PAD! is an extremely flexible technology which is currently being developed as a fast imager. We describe the architecture of the Cornell PAD, which is capable of operating with submicrosecond frame times. This 100 392 pi...

The CALICE Electromagnetic CALorimeter (ECAL) will be a silicon-tungsten sampling calorimeter [1] with 30 layers of silicon wafers, each containing an 18×18 array of diode pads, giving 9720 channels to be read out. The signal from each pad is amplified by a Very Front End (VFE) ASIC [2] which multiplexes the signals from 18 pads onto one output line. The silicon wafers and VFE chips are mounted...

The paper presents a new silicon wafer bonding technique. The high-resolution bonding pad is defined through photolithography process. Photosensitive materials with patternable characteristics are served as the adhesive intermediate bonding layer between the silicon wafers. Several types of photosensitive materials such as SU-8 (negative photoresist), AZ-4620 (positive photoresist), SP341 (poly...

(This is part 2, continued from “Use of harsh Wafer Probing to Evaluate Traditional Bond Pad Structures”). Goals for circuit under pad (CUP) in aluminum – silicon dioxide (Al – SiO2) based IC pad structures include the design of metal interconnects in all layers beneath the pad Al, and the ability to withstand harsh probing and wirebonding stress without SiO2 cracking, without deforming or bend...