نتایج جستجو برای: silicon backplate
تعداد نتایج: 81405 فیلتر نتایج به سال:
The paper describes new developments in air-coupled ultrasonic transducers that can be used to focus energy in air. All transducers to be described are based on a capacitive design, using a rigid backplate and a thin polymer membrane. There are three approaches that can be used to achieve focussing, all of which are described: focussing with a mirror, using curved back-plates, and linear phased...
Micromachined microphones that use a diffraction-based optical method for integrated interferometric detection of diaphragm displacement are described. With optoelectronics integration, this approach yields highly sensitive microphones in mm-cube volumes. Furthermore, the electrical port of the device, which is freed by optical detection, is used for electrostatic actuation of the microphone di...
In this paper, a novel single-chip MEMS capacitive microphone is presented. The novelties of this method relies on the moveable aluminum (Al) diaphragm positioned over the backplate electrode, where the diaphragm includes a plurality of holes to allow the air in the gap between the electrode and diaphragm to escape and thus reduce acoustical damping in the microphone. Spin-on-glass (SOG) was us...
To facilitate the attainment of higher performance in tandem perovskite/silicon solar cell, this work seeks to conduct thermodynamic modeling and analysis a spectrum splitting hybridized with thermoelectric (TE) devices. A dichroic beam splitter is employed as concentrator for utilization entire effects temperature dependency leg geometry alteration are considered TE device pins. Additionally, ...
PURPOSE Recent use of a titanium (Ti) backplate has improved the design and biocompatibility of the Boston Keratoprosthesis (BKpro). Titanium's shiny metallic appearance, however, makes the cosmetic outcome less favorable. The purpose of this study was to develop and test a coloring surface modification of Ti. METHODS Ti coloring was achieved using electrochemical anodization. Color assessmen...
This paper reports the reduction of package-stresses by in tm ducing a decoupling zone directly m u n d a sensor structure. Different geometries of the decoupling zones are compared, using the Fdte Element Method (FEM) and analytical models. A large reduction is obtained in case of a corrugated decoupling zone. To optimize the reduction, an analytical description of a ring-shaped V-groove is gi...
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