This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...

PREFACE It is customary for a book to have a preface, wherein the author explains why he wrote it and how it differs from all the other books on a similar subject. This book came about because I was asked to update one of our sophomore courses, in part to add some material on semiconductor devices and technology and in part to increase the breadth of the course and improve its links to other pa...

The paper deals with the analysis of pair di usion models in semiconductor technology. The underlying model contains reaction-drift-di usion equations for the mobile point defects and dopant-defect pairs as well as reaction equations for immobile dopants which are coupled with a nonlinear Poisson equation for the chemical potential of the electrons. For homogeneous structures we present an exis...