extended interaction oscillators (eio) are vacuum electronic sources of microwave, millimeter-wave and terahertz radiations. in this paper, eio is investigated by using a circuit model. the value of the coupling element in the model is evaluated from the near band-edge dispersion characteristics of the rf structure. the end external loading of the interaction structure is equivalently modeled b...

PURPOSE Numerical study of microwave imaging and microwave-induced thermoacoustic imaging utilizes finite difference time domain (FDTD) analysis for simulation of microwave and acoustic interaction with biological tissues, which is time consuming due to complex grid-segmentation and numerous calculations, not straightforward due to no analytical solution and physical explanation, and incompatib...

The worldwide diffusion of wireless telecommunication systems opened new perspectives for microwave technologies. High-volume microwave monolithic integrated circuit (MMIC) production became a reality, revolutionizing the approach to microwave-circuit design. Nowadays, this is based on the intensive use of accurate simulation and computer-aided-design (CAD) tools. While scattering parameter mea...

Microwave circuits are indispensable for mobile and multimedia communication. However, these circuits are very difficult to design, because of the nature of distributed-constant circuits in the microwave range (i.e., over 1 GHz). These circuits are also difficult to adjust for optimum performance, even for experienced engineers. These related problems make development costs of microwave circuit...

Electromagnetic waves are ideal candidates for transmitting information in a quantum network as they can be routed rapidly and efficiently between locations using optical fibres or microwave cables. Yet linking quantum-enabled devices with cables has proved difficult because most cavity or circuit quantum electrodynamics systems used in quantum information processing can only absorb and emit si...

Because microwave products in the consumer electronics market are continuous developing, device and component manufacturers have to seek new advanced integration, packaging and interconnection technologies, as size, cost and performance are critical factors for the success of a microwave product. One of the most promising integration technologies is the multilayer low temperature co-fired ceram...

This paper provides an alternative and highly accurate method in predicting Small Signal Performance of Microwave Amplifier. An Electromagnetic (EM) simulator that based on Finite Element Method (FEM) was used in combination with the conventional SPICE-based microwave circuit simulator in order to demonstrate the superiority in performance outcome such as Rollet Stability Factor (K), Return Los...