The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120◦C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the va...

Sn–9Zn solder joints containing Ag nano particles were prepared by mechanically mixing Ag nano particles (0.3, 0.5 and 1 wt%) with Sn–9Zn solder paste. In the monolithic Sn–Zn solder joints, scallop-shaped AuZn3 intermetallic compound layers were found at their interfaces. However, after the addition of Ag nano particles, an additional uniform AgZn3 intermetallic compound layer well adhered to ...

the aim of this project is to fabricated an aluminium-copper bimetal through the fusion method and examine its performance. an aluminium-copper-aluminium bimetal was built by the laser cladding method. the laser power as well as the annealing time effects on its interfacial properties of the bonding’s formed through the laser cladding were investigated. to fabricate the multilayer bimetal, the ...

This study investigated the interfacial microstructure between gold-coated titanium and low-fusing porcelain. The square surfaces of cast titanium split rods were sputter-coated with gold using a sputter coater at 40 mA for 1,000 seconds. Specimens were prepared for transmission electron microscopy (TEM) by cutting and polishing two pieces of the gold-coated split-rod specimens, which were glue...

An experiment on the early stages of intermetallic compound layer growth during soldering and its theoretical analysis were conducted with the intent to study the controlling factors of the process. An experimental technique based on fast dipping and pulling of a copper coupon in liquid solder followed by optical microscopy allowed the authors to study the temporal behavior of the sample on a s...

Although the primary driver for the current interest in developing lead-free soldering is global market pressure for more environmentally friendly products, the main concern continues to be lead contamination from end-of-life electronic products in landfill sites. In response to existing and impending legislation in Europe and Japan for the elimination of lead from electronic products, the indu...