As we enter the post-Moore era, heterogeneous optoelectronic integrated circuits (OEICs) are attracting significant attention as an alternative approach to scaling smaller-sized transistors. Two-dimensional (2D) materials, offering a range of intriguing properties semiconductors, semimetals, and insulators, provide great potential for developing next-generation OEICs. For instan...

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Wire bonding has been used in integrated circuit (IC) packaging for many years. However, there are many challenges in wire bonding for optoelectronics packaging. These challenges include bonding on sensitive devices, bonding over cavity, bonding over cantilevel leads and bonding temperature limitations. The optoelectronics package design brings another challenge, which requires wire bonding to ...

The rapid development and unique properties of two-dimensional (2D) materials, such as graphene, phosphorene and transition metal dichalcogenides enable them to become intriguing candidates for future optoelectronic applications. To maximize the potential of 2D material-based optoelectronics, various photonic structures are integrated to form photonic structure/2D material hybrid systems so tha...