Modern electronics products move in the direction of complex, high density, high speed and also thinner and lighter for portability. Reliability of interconnection of electronics packaging has become critical issue. Major functions of electronic packaging are briefly discussed and failure mechanisms of electronic packaging are explained. Electronics packaging is subjected to mechanical vibratio...

he United States is running out of T landftlls and that is where most trash, and thus most packaging 1 material, ends up. For example, we generate 180 million tons of solid waste per year, 70% of which goes into landfills. However, in the last 12 years, two-thirds of our landfills have been exhausted. The problem gained national attention in 1989 when a garbage barge from New York wandered acro...

Materials and processes are being developed for packaging of low and medium power, high temperature electronics (up to 500). Ceramic (Al2O3 and AlN) hermetic packages are being used. Die attach techniques based on patterned Au bumps, Au-Si and off-eutectic Au-Sn have been demonstrated. Au thermosonic wire bonding provides a monometallic interconnect system between the die and the package pads. ...

Power electronics are important in managing applications such as hybrid vehicles, power supplies, and induction heating to name a few. Power electronics mainly involve the control and conversion of an energy source from one form to another. The encasing of these devices requires design that will enhance thermal dissipation along with the improvement of electrical properties. The packaging of PE...

Power electronics is important in managing such applications as hybrid vehicles, power supplies, and induction heating to name a few. Power electronics mainly involves the control and conversion of an energy source from one form to another. The encasing of these devices requires design that will enhance thermal dissipation along with the improvement of electrical properties. The packaging of PE...

In this paper we investigate the influence of 1st-level packaging components on the electromagnetic behaviour of power electronic modules. The main goal is to identify the critical layout paths and packaging components and to understand the mechanisms that affect the module performance. Several power electronics packaging technologies are compared on the basis of their electrical and electromag...

Standard packaging and interconnection technologies of power devices have difficulties meeting the increasing thermal demands of new application fields of power electronics devices. Main restrictions are the decreasing reliability of bond-wires and solder layers with increasing junction temperature. In the last few years intensive efforts have been invested in developing new packaging and inter...

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500°C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-...