Au (0.05 μm) 69.4 μm Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead...

We present real-time transmission electron microscopy of nanogap formation by feedback controlled electromigration that reveals a remarkable degree of crystalline order. Crystal facets appear during feedback controlled electromigration indicating a layer-by-layer, highly reproducible electromigration process avoiding thermal runaway and melting. These measurements provide insight into the elect...

Electromigration is increasingly relevant to the physical design of electronic circuits. It is caused by excessive current density stress in the interconnect. The ongoing reduction of circuit feature sizes has aggravated the problem over the last couple of years. It is therefore an important reliability issue to consider electromigration-related design parameters during physical design. In this...

A model for early failure due to electromigration in copper dualdamascene interconnects is proposed. The model is based on analytical expressions obtained from solutions of electromigration stress build-up assuming slit void growth under the interconnect vias. It is demonstrated that the model satisfactorily describes the complex physics of void nucleation and growth of the electromigration dam...

Today, the price of building a factory to produce submicron size electronic devices on 300 mm Si wafers is over billions of dollars. In processing a 300 mm Si wafer, over half of the production cost comes from fabricating the very-large-scale-integration of the interconnect metallization. The most serious and persistent reliability problem in interconnect metallization is electromigration. In t...

Abstract. Modern interconnect structures are exposed to high mechanical stresses during their operation. These stresses have their sources in interconnect process technology and electromigration. The mechanical properties of passivating films and the choice of process technology influence electromigration reliability. In this paper we analyze the interplay between electromigration and mechanica...

Quantitative studies of nanoscale heat dissipation (Joule heating) are essential for advancing nano-science and technology. Joule heating is widely expected to play a critical role in accelerating electromigration induced device failure. However, limitations in quantitatively probing temperature fields—with nanoscale resolution—have hindered elucidation of the role of Joule heating in electromi...

We report on the control of the faceting of crystal surfaces by means of surface electromigration. When electromigration reinforces the faceting instability, we find perpetual coarsening with a wavelength increasing as t(1/2). For strongly stabilizing electromigration, the surface is stable. For weakly stabilizing electromigration, a cellular pattern is obtained, with a nonlinearly selected wav...

Using a scanning electron microscope, we make real-time movies of gold nanowires during the process of electromigration. We confirm the importance of using a small series resistance when employing electromigration to make controlled nanometer-scale gaps suitable for molecular-electronics studies. We are also able to estimate the effective temperature experienced by molecular adsorbates on the n...

Chemical functionalization of graphene holds promise for various applications ranging from nanoelectronics to catalysis, drug delivery, and nanoassembly. In many applications it is important to be able to transport adsorbates on graphene in real time. We propose to use electromigration to drive the adsorbate transport across the graphene sheet. To assess the efficiency of electromigration, we d...