ni-p and ni layers multilayer coatings were applied to az31 magnesium alloy utilizing electroless and electrodeposition procedures. the aim of the project was to decrease cracks and increase corrosion resistance of the coatings. in order to compare the coatings, the effect of single layer electroless ni-p coatings with different thicknesses was also investigated. the microstructure and phase co...

The use of magnesium alloys is limited due to their susceptibility to corrosion although they have many attractive physical and mechanical properties. To increase mechanical and corrosion properties of these alloys, many deposition method and coating types are used. Electroless Ni–B coatings have received considerable interest recently due to its unique properties such as cost-effectiveness, th...

In this study, interfacial reactions of electrolytic Ni and electroless Ni(P) metallization of the ball-grid-array (BGA) substrate with the molten n–9Zn (wt.%) eutectic solder alloy were investigated, focusing on the shear strengths and the identification of the intermetallic compound IMC) phases at various reflow periods. Zn-containing Pb-free solder alloys were kept in molten condition (240 ◦...

Ni-P and Ni layers multilayer coatings were applied to AZ31 magnesium alloy utilizing electroless and electrodeposition procedures. The aim of the project was to decrease cracks and increase corrosion resistance of the coatings. In order to compare the coatings, the effect of single layer electroless Ni-P coatings with different thicknesses was also investigated. The microstructure and phase co...

The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120◦C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the va...

in this research a layer of ni-cu-p was deposited on 304 stainless steels by using gelatin and thiourea asadditives in a sulfate solution. in order to determine the properties of deposited layers, a microhardness testerwas used for microhardness measurement, x.r.d. for microstructural analysis, and a scanning electronmicroscope equipped with e.d.x. for determining morphology and analyzing the d...

in this research, tribological characteristics of ni-p electroless coating and double-layered ni-p/ni-b electroless coating were studied. for this purpose, ni-p electroless coating with 25 μm thickness was initially applied to the surface of steel ck45 samples; then, a double-layered ni-p/ni-b electroless coating, including inner layer of ni-p with 15 μm thickness and outer layer of ni-b with 1...

Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...

In this research, tribological characteristics of Ni-P electroless coating and double-layered Ni-P/Ni-B electroless coating were studied. For this purpose, Ni-P electroless coating with 25 μm thickness was initially applied to the surface of steel Ck45 samples; then, a double-layered Ni-P/Ni-B electroless coating, including inner layer of Ni-P with 15 μm thickness and outer layer of Ni-B with 1...

This review outlines the development of electroless Ni–P composite coatings. It highlights the method of formation, mechanism of particle incorporation, factors influencing particle incorporation, effect of particle incorporation on the structure, hardness, friction, wear and abrasion resistance, corrosion resistance, high temperature oxidation resistance of electroless Ni–P composite coatings ...