In this paper a new method for the design of a linear phase distributed amplifier in 180nm CMOS technology is presented. The method is based on analogy between transversal filters and distributed amplifiers topologies. In the proposed method the linearity of the phase at frequency range of 0-50 GHz is obtained by using proper weighting factors for each gain stage in cascaded amplifier topology....

Background and Objectives: In this paper, a new design strategy was proposed in order to enhance bandwidth and efficiency of power amplifier. Methods: To realize the introduced design strategy, a power amplifier was designed using TSMC CMOS 0.18um technology for operating in the Ka band, i.e. the frequency range of 26.5-40GHz. To design the power amplifier, first a power divider (PD) with a ver...

in this study an ultra-broad band, low-power, and high-gain cmos distributed amplifier (cmos-da) utilizing a new gain-cell based on the inductively peaking cascaded structure is presented. it is created bycascading of inductively coupled common-source (cs) stage and regulated cascode configuration (rgc).the proposed three-stage da is simulated in 0.13 μm cmos process. it achieves flat and high ...

In this paper, analysis, simulation and design of a distributed amplifier (DA) with 0.13µm CMOS technology in the frequency range of 3-40 GHz is presented. Gain cell is a current reused circuit which is optimum in gain, noise figure, bandwidth and also power dissipation. To improve the noise performance in the frequency range of interest, a T-matching low pass filter LC network which is utilize...

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[51 Bondwire inductors 0.3 3 5 * 1.2 0 . 7 2 ~ 0.32 5.1 7 4.7 c -6 4 9 3 54 Abstrncf A CMOS distributed amplifier (DA) covering 0.6 to 22 GHz is presented in this paper. Cascode gain cells and m-derived matching sections are used to enhance the gain and bandwidth performance. The DA chip achieves measured gain of 7.3 f 0.8 dB with chip area of 0.9 x 1.5 mm’ including testing pads. The amplifier...

a novel low noise trans-impedance amplifier is proposed using low cost 0.18 µm cmos technology. a resistive-capacitive feedback is used to extend the bandwidth of the amplifier. as the structure is inductor less, it is suitable for low cost integrated optical interconnects. in this paper improved particle swarm optimization have applied to determine optimal trans-resistance and noise of propose...

In this study an ultra-broad band, low-power, and high-gain CMOS Distributed Amplifier (CMOS-DA) utilizing a new gain-cell based on the inductively peaking cascaded structure is presented. It is created bycascading of inductively coupled common-source (CS) stage and Regulated Cascode Configuration (RGC).The proposed three-stage DA is simulated in 0.13 μm CMOS process. It achieves flat and high ...

A power amplifier (PA) is a key part of the RF front-end in transmitters for a local broadband network. Today, commercial PAs are made of III-V HEMT and HBT technology with excellent results. An integrated system-on-chip power amplifier circuit using CMOS technology for cost-effective and spectrum-efficient high-speed wireless communication presents major challenges because power amplifiers hav...