Using pulsed double electrode-gas metal arc welding, aluminum wires are joined to copper plates with fillers of different fractions silicon. Two layers microstructures formed near the Al-Cu interface: one consists a hypoeutectic microstructure α (Al) + Al2Cu, and other an intermetallic compound (IMC) Al2Cu. Increasing heat input causes increases in thicknesses IMC layer microstructure. Si suppr...

Bulk metallic glasses (BMGs) and nanocrystalline metals (NMs) have been extensively investigated due to their superior strengths and elastic limits. Despite these excellent mechanical properties, low ductility at room temperature and poor microstructural stability at elevated temperatures often limit their practical applications. Thus, there is a need for a metallic material system that can ove...

Abstract Compared with other gold plating processes, mercury gilding was widely used in ancient China due to the less consumption of and excellent adhesion between layer substrate. Herein, comprehensive analyses silver crown boots unearthed from Consort Tombs Emperor Shengzong (圣宗萧贵妃) Liao (辽) Dynasty reveal surface composition structural characteristics also unique multilayered structure cross...

The precipitation strengthening of Cu alloys inevitably accompanies lowering of their electric conductivity and ductility. We produced bulk Cu alloys arrayed with nanofibers of stiff intermetallic compound through a precipitation mechanism using conventional casting and heat treatment processes. We then successfully elongated these arrays of nanofibers in the bulk Cu alloys to 400% of original ...

The effects of a third element, namely silver, copper, zinc, or antimony, on the microstructure and mechanical properties of eutectic tin-bismuth (Sn–Bi) solder were investigated. The investigation showed that, except for zinc, the addition of a trace amount of the third element improves the ductility of the Sn–Bi solder owing to the formation of a fine, homogeneous ternary eutectic microstruct...