نتایج جستجو برای: electronics packaging

تعداد نتایج: 105576  

2006
Spyridon Nomikos Panayiotis Koutsabasis Jenny S. Darzentas Thomas Spyrou John Darzentas

Packaging is currently at the centre of an intensive research effort that is being carried out regarding new technologies that integrate digital data in and on a package. This effort has been fuelled by recent developments in electronics technology, materials and processes that offer the potential to create inexpensive ways to produce packaging that can carry disposable digital machine readable...

2000
Thomas G. Wilson

Power electronics, as defined by Thomas G. Wilson, is:" The technology associated with the efficient conversion, control and conditioning of electric power by static means from its available input form into the desired electrical output form." The goal of power electronics is to realize power conversion from an electrical source to an electrical load in a highly efficient, highly reliable and c...

Journal: :Microelectronics Reliability 2010
Reinhold Bayerer

Power density of power electronics will continue to grow. It is always supported by progress in power semiconductors. Further significant loss reduction of IGBT and diodes becomes possible if power circuit design improves with respect to electro-dynamic performance. Efforts to improve cooling for better power dissipation out of smaller volumes appear to be disadvantageous in comparison to incre...

Journal: :Nanoscale 2015
Ruo-Zhou Li Anming Hu Denzel Bridges Tong Zhang Ken D Oakes Rui Peng Uma Tumuluri Zili Wu Zhili Feng

Nanoinks are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate ink amenable to very strong low temperature packaging, and investigated the relationship between bonding strength and electrical conductivity post-bonding. PVP shell plastic deformati...

2016
Vern Solberg

The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. By integrating multiple die elements within a single package outline, product boards can be made significantly smaller than their forerunners and the ...

2002
Hua Ye Minghui Lin Cemal Basaran

The development of power electronics technology is driven by the insatiate demand to control electrical power. The new power electronics devices reduce the volume of the converters by three to four orders of magnitude compared to their mercury arc predecessor. And the turn-on and turn-o0 time has decreased from milliseconds to the microseconds and even nanoseconds, depending on power level. The...

2013
Yi Zheng Zhizhu He Yunxia Gao Jing Liu

There currently lacks of a way to directly write out electronics, just like printing pictures on paper by an office printer. Here we show a desktop printing of flexible circuits on paper via developing liquid metal ink and related working mechanisms. Through modifying adhesion of the ink, overcoming its high surface tension by dispensingmachine and designing a brush like porous pinhead for prin...

2013
Chao Jin Jie Zhang Xiaokang Li Xueyao Yang Jingjing Li Jing Liu

Conventional transplantable biomedical devices generally request sophisticated surgery which however often causes big trauma and serious pain to the patients. Here, we show an alternative way of directly making three-dimensional (3-D) medical electronics inside the biological body through sequential injections of biocompatible packaging material and liquid metal ink. As the most typical electro...

2011
Satish Kumar Baratunde A. Cola Roderick Jackson Samuel Graham G. W. Woodruff

The exceptional electronic, thermal, mechanical, and optical characteristics of carbon nanotubes offer significant improvement in diverse applications such as flexible electronics, energy conversion, and thermal management. We present an overview of recent research on the fabrication, characterization and modeling of carbon nanotube (CNT) networks or ensembles for three emerging applications: t...

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