Title of Document: CHARACTERIZATION OF FR-4 PRINTED CIRCUIT BOARD LAMINATES BEFORE AND AFTER EXPOSURE TO LEAD-FREE SOLDERING CONDITIONS Ravikumar Sanapala, Master of Science, 2008 Directed By: Chair Professor, Michael G. Pecht, Department of Mechanical Engineering The transition to lead-free soldering of printed circuit boards (PCBs) using solder alloys such as Sn/Ag/Cu has resulted in higher t...