In this paper we review our work in the field of heterogeneous III-V semiconductor/silicon photonic integrated circuits for application in Fiber-to-the-Home optical access networks and chip-scale optical interconnects. Several optical and opto-electronic components realized on this platform are described. The fabrication of the silicon waveguide structures is done in a CMOS pilot line on 200mm ...

We report the application of the technique of infrared transmission to measure the temperature of silicon wafers during the growth of silicon-germanium alloy heteroepitaxial layers in a rapid thermal processing system. The silicon-germanium alloy layers have negligible absorption at 1.3 and 1.55 pm over wide ranges of thickness, composition, and strain condition. The substantial improvement of ...

Porous Silicon (PS) layers have been prepared from p-type silicon wafers of (100) orientation. SEM, XRD, FTIR and PL studies were done to characterize the surface morphological and optical properties of PS. The porosity of the PS samples was determined using the parameters obtained from SEM images by geometric method. The refractive index values of the PS samples as a function of poros...

Ordered gold nanoparticle arrays with high lateral density of 6.87 × 1010 nanoparticles cm−2, which are stable up to temperatures of 600 ◦C, were fabricated. To this end, nanoparticles formed by thermal vacuum evaporation of Au were immobilized within the pores of nanoporous silicon wafers prepared by block copolymer lithography coupled with dry plasma etching. Even after high-temperature treat...

We fabricate and characterize waveguides composed of closely spaced and longitudinally oriented silicon ridges etched into silicon-on-insulator wafers. Through both guided mode and bulk measurements, we demonstrate that the patterning of silicon waveguides on such a deeply subwavelength scale is desirable for nonlinear and sensing applications alike. The proposed waveguide geometry simultaneous...

Silicon (Si) micromachining techniques have recently witnessed significant advancement, attributable to the high surge in demand for microelectromechanical and microelectronic devices. Micromachining are widely used cut or pattern Si, order obtain high-quality surface finishes fabrication of three-dimensional (3D) microstructures In this work, capabilities competencies non-traditional Si techni...

A new sonochemical process for the top-down production of silicon nanoparticles (<1 nm) with surface functional groups is described. The procedure involves a combination of acoustic cavitation erosion of a single-crystalline silicon surface coupled with simultaneous reaction with a reactive organic compound such as 1-hexyne. The sonochemical formation of the photoluminescent silicon nanoparticl...

The p-type crystalline silicon wafers have occupied most of the solar cell market today. However, modules made with n-type crystalline silicon wafers are actually the most efficient modules up to date. This is because the material properties offered by n-type crystalline silicon substrates are suitable for higher efficiencies. Properties such as the absence of boron-oxygen related defects and a...