For wafer sizes in state-of-the-art semiconductor manufacturing ranging up to 300 mm, the uniformity of processes across the wafer becomes a very important issue. We present a fully three-dimensional model for the feature scale simulation of continuum transport and reaction determined high-pressure chemical vapor deposition processes suitable for the investigation of such nonuniformities. The n...

Two sets of hydrogenated microcrystalline silicon thin-film samples were prepared by Plasma Enhanced Chemical Vapor Deposition (PECVD) technique at different deposition conditions of excited power and pressure. The correlation between the crystalline volume fraction for the samples determined from Raman spectra and the excited power, pressure, absorption coefficient, refractive index and optica...

The simultaneous generation of dust during the deposition of semiconducting thin films by radio frequency plasma enhanced chemical vapor deposition has so far been regarded as a troublesome by-product. However, we present results from recent microstructural investigations of carbonaceous dust particles from a methane precursor that demonstrate that the technique may be suited to generating full...

Articles you may be interested in High-quality 1.3 m-wavelength GaInAsN/GaAs quantum wells grown by metalorganic vapor phase epitaxy on vicinal substrates Appl. Relaxed, high-quality InP on GaAs by using InGaAs and InGaP graded buffers to avoid phase separation High-detectivity InAs quantum-dot infrared photodetectors grown on InP by metal–organic chemical–vapor deposition Appl. High detectivit...

Stopping the plasma-enhanced chemical vapor deposition (PECVD) once and maintaining the film in a vacuum for 30 s were performed. This was done several times during the formation of a film of i-layer microcrystalline silicon (μc-Si:H) used in thin-film silicon tandem solar cells. This process aimed to reduce defect regions which occur due to collision with neighboring grains as the film becomes...

The use of the Plasma Enhanced Chemical Vapor Deposition techniques have increased during the last decades. PECVD attractiveness, basically due to the lowering of the substrate temperatures, has enlarged its uses because it allows an action of ions or excited species. However, the choice of the reactors is not always easy. After presenting the main domains of applications of the PECVD technique...

The quenching of the photoluminescence of Si nanopowder grown by plasma-enhanced chemical vapor deposition due to pressure was measured for various gases ~ H2, O2, N2, He, Ne, Ar, and Kr! and at different temperatures. The characteristic pressure, P0, of the general dependence I(P) 5 I0 exp( 2 P/P0) is gas and temperature dependent. However, when the number of gas collisions is taken as the var...

The growth of vertically aligned carbon nanotubes using a direct current plasma enhanced chemical vapor deposition system is reported. The growth properties are studied as a function of the Ni catalyst layer thickness, bias voltage, deposition temperature, C2H2:NH3 ratio, and pressure. It was found that the diameter, growth rate, and areal density of the nanotubes are controlled by the initial ...

Microstructures of well-aligned multiwall carbon nanotubes grown on patterned nickel nanodots and uniform thin films by plasma-enhanced chemical vapor deposition have been studied by electron microscopy. It was found that growth of carbon nanotubes on patterned nickel nanodots and uniform thin films is different. During growth of carbon nanotubes, a nickel particle sits at the tip of each nanot...