ELECTRONIC AND OPTICAL MATERIALS A: Amorphous and Polycrystalline Thin-Film Silicon Science and Technology B: Concepts in Molecular and Organic Electronics C: CMOS Gate-Stack Scaling—Materials, Interfaces, and Reliability Implications D: Materials, Processes, and Reliability for Advanced Interconnects for Microand Nano-Electronics E: Science and Technology of Chemical Mechanical Planarization F...

Miniaturization of electronics to nanoscale leads to significantly higher current density levels and larger thermal gradients in electronics packaging. Laboratory test data show that thermomigration plays a significant role in high current density induced failure in solder joints and interconnects. In this paper, a computational damage mechanics model for thermomigration process is proposed and...

Wafer-level packaging (WLP) is a next-generation semiconductor packaging technology that is important for realizing high-performance and ultra-thin semiconductor devices. However, the molding process, which is a part of the WLP process, has various problems such as a high defect rate and low predictability. Among the various defect factors, the die shift primarily determines the quality of the ...

A novel packaging solution for GaN power electronics for efficient heat extraction in high power devices is presented. The benefits of using silver diamond composites as base plate in packages for GaN power bars are demonstrated. Micro-Raman thermography measurements were carried out to probe the device temperature for devices mounted on different base plates, silver diamond composites and stan...

To successfully implement a packaging concept, it is imperative to resolve many challenging issues related to materials and processing, which will result in improved thermal management of the power electronics modules. Almost every parameter of a power device is a function of temperature. The heat generated by these active devices, which reduces circuit efficiency, may also degrade circuit perf...

The purpose of his paper is to identify and briefly discuss some important areas where (additional) research is needed to be able to within 5-20 years realize the four “example-visions” presented in www.netpack-europe.org, Visions Lab: Augmented Reality, Personal Liberator, Clever Paper and Healthy Freedom. In total these visions embrace very diverse technology areas, many of those extending ou...

Packaging and interconnect technologies are critical to the advancement of micro-scale and nano-scale systems. This paper will review some examples of our studies on flip-chip assembly, solder self-assembly, automated tuning and fixing, flexible circuits, atomic layer deposition and liquid crystal polymer for manufacturable and reliable microelectromechanical systems (MEMS). In addition, we wil...