The purpose of this study was to examine the effect of thermal cycling on microleakage of a fissure sealant after it was bonded with different bonding agents and polymerized with different light curing units. To this end, two bonding agents (Xeno III, iBond), three light curing units (Astralis 3, Elipar free-light, Elipar free-light 2), and a fissure sealant (Fissurit FX) were used. Microleakag...

In this study, a waterproof material was used to fabricate microcapsule by interfacial curing reaction to encapsulate an alkaliphilic spore-forming bacterium. The technical feasibility of encapsulated spores and the influence of three kinds of curing agent on the calcium precipitation activity (CPA) of the bacterium were studied. Furthermore, micromorphology of microcapsules was observed by Sca...

A micromechanics based thermal model was developed to predict the temperature and degree of cure (DOC) distribution inside a unidirectional fiber reinforced composite during the curing process. Using the concentric cylinder assemblage (CCA) model as a representation of the composite microstructure, the effective thermodynamic properties of the composite were computed based on the fiber and matr...

In this study we report X-ray diffraction and dilatometry results of metakaolin (MK) geopolymers produced with Na, K, Rb or Cs silicate solutions, and cured for 7 days and 5 years, with the aim of identifying variations in structure and performance (dimensional stability at elevated temperature) over an extended curing period at ambient temperature. All of the geopolymers studied are mainly X-r...

In this study, lignin, an aromatic compound from the forestry industry, was used as a renewable material to synthesize a new aromatic amine curing agent for epoxy resin. Firstly, lignin was separated from black liquor and hydroxyl groups were converted to tosyl groups as leaving groups. Then, primary amination was conducted using an ammonia solution at high pressure and temperature, in the pres...

A comparative study of the changes in the chemical structure and properties of hydrogen silsesquioxane HSQ resists induced by thermal curing and electron-beam exposure has been conducted. Studies using Fourier transform infrared FTIR spectroscopy suggested similar behavior in the redistribution of bonds for both processes. Quantitative analysis of both spectra revealed the existence of a critic...

Even though recently published results indicated that residual strains of the epoxy molding compound (EMC) play a key role on the warpage values and shapes of the plastic ball grid array (PBGA) packages, it is still unknown about how these residual strains build up and change during the manufacturing and infrared (IR) solder reflow processes. The purpose of this study is to quantify the residua...

This paper deals with a new silicone resin compound that can be cured by addition curing and peroxide curing, respectively. Curing post-curing behavior has been investigated optimized. Numerous trials towards the optimization of binder-filler combinations have performed. The resulting material POWERSIL® Resin 710 respect to its mechanical thermal behavior. exhibits heat class R processed press ...

afinite element model is developed for simulation of the curing process of a thick axisymmetric rubber article reinforced by metal plates during the molding and cooling stages. the model consists of the heat transfer equation and a newly developed kinetics model for the determination of the state of cure in the rubber. the latter is based on the modification of the well-known kamal-sourour mode...

nanocomposite vulcunizates based on styrene-butadiene rubber (sbr), organoclay and a conventional sulfur curing system were prepared by melt blending process in an internal mixer. in order to study the effects of the type of interfacial compatibilizer on the properties of sbr and clay nanoparticles,three types of compatibilizers, maleic anhydride grafted ethylene-propylene diene rubber (epdm-g-...