Introduction Parts of a bridge are related either clinically by the dentist, the direct index, or by the technician in the laboratory, the indirect index, to assemble the parts and invest them for soldering. T o form a direct occlusal index the dentist seats the bridge parts on the teeth and usually either makes a plaster impression record' or uses a self-curing acrylic resin record from which ...

Alloy Al – 27% Cu – 6% Si has a composition close to an eutectic one [1, 2] and is widely used as a solder (A34) for soldering aluminum and its alloys [3]. The main problem in fabrication of cast solder A34 is the formation of a ternary ( + CuAl 2 + Si) eutectic and primary silicon crystals in its structure, which lowers substantially the process and operating properties of the alloys. It is kn...

In the past years, use of low silver content SAC0307 (99Sn0.3Ag0.7Cu wt%) solder alloy grew considerably due to its good soldering quality. latest version this alloy, manganese, and bismuth are used improve further parameters. study, a reliability issue, whisker growth from SAC0307-Mn07 SAC0307-Bi1-Mn07 alloys was investigated. Ultra-thin films (in 100–150 nm thickness) were vacuum evaporated i...

we chose Sn10Bi, Sn10Bi10In, Sn20Bi, and Sn20Bi20In (numbers are in weight percent) rapidly solidified from melt using melt-spinning technique for intermediate –step soldering. We then investigated the structure, electrical and mechanical properties of the melt-spun ribbons using x-ray diffraction, double bridge circuit, dynamic resonance technique, and Vickers microhardeness tester. It was con...

The aim of this study was to evaluate the fit between dental abutments and the metal framework of a 3-unit fixed prosthesis screwed to two implants to determine whether sectioning and soldering of the framework are in fact necessary procedures. The study was based on a model of a metal framework of a 3-unit prosthesis screwed to two implants. A total of 18 metal frameworks were constructed and ...

Soldering failures lead to considerable manufacturing costs in the electronics assembly industry. Soldering problems can be caused by improper parameter settings during paste stencil printing, component placement, the solder reflow process or combinations thereof in surface mount assembly (SMA). Data mining has emerged as one of the most dynamic fields in processing large manufacturing database...

Soldering of molded case tantalum capacitors can result in damage to Ta2O5 dielectric and first turn-on failures due to thermo-mechanical stresses caused by CTE mismatch between materials used in the capacitors. It is also known that presence of moisture might cause damage to plastic cases due to the pop-corning effect. However, there are only scarce literature data on the effect of moisture co...