Background knowledge from Linked Open Data sources can be used to improve the results of a data mining problem at hand: predictive models can become more accurate, and descriptive models can reveal more interesting findings. However, collecting and integrating background knowledge is a tedious manual work. In this paper we propose a set of desiderata, and identify the challenges for developing ...

In accordance with the requirements for the degree of Bachelor of Engineering (Honours) in the division of Electrical Engineering, I hereby submit for your consideration this thesis entitled " P-N junction doping profile extraction via inverse modelling ". The work was performed under the supervision of Associate Professor Y.T Yeow. I declare that the work submitted in this thesis is my own, ex...

A vision of the future is presented in which the design of semiconductor fabrication processes is an integral part of the design of application specific circuits. The circuit designer (particularly of analog and microelectromechanical devices and circuits) will no longer be restricted to processing specification solely via layout and mask information, but will also directly specify process para...

The diffusion of dopants in silicon at high temperatures is modeled by a nonlinear parabolic system of partial differential equations on a twodimensional region with a moving boundary. A numerical solution using the L-stable TRBDF2 time integration method and a “box method” spatial discretization is described. Details are given of the methods used to specify and manipulate curves, and to define...

This paper presents an electrically-mediated process for copper metallization of semiconductor interconnect features. Compared to traditional metallization processes, the proposed electrochemical deposition process uses a singlecomponent bath that contains no difficult-to-control organic accelerators and levelers. The feasibility of the process is demonstrated by copper deposition onto sectione...

Titanium nitride (TiN) not only was utilized in the wear-resistant coatings industry but it was also adopted in barrier processes for semiconductor manufacturing. Barrier processes include the titanium (Ti) and TiN processes, which are commonly used as diffusion barriers in via/contact applications. However, engineers frequently struggle at the via/contact module in the beginning of every techn...

There is a critical need for exact, real-time reaction control of the chemical vapor deposition (CVD) systems that are used for semiconductor device manufacture [1]. At present, the development of real-time control for reactions within production-style reactor configurations is hampered by a number of issues: The nature, concentrations and physical distributions of the chemical species within t...

Transport of electrons in semiconductor nano-structures exhibits many features that are a consequence of quantum confinement and Coulomb blockade. A quantum dot coupled to a metal-oxide-semiconductor transistor’s channel region is one example of such a structure with utility as a dense semiconductor memory. The memory state of this unit cell is a function of the number of electrons stored in th...