The fabrication of integrated circuits relies on a process known as photolithography, in which a photoreactive polymer, or pho-toresist, is applied to the surface of a silicon wafer. Integrated circuit manufacturers rely on photolithography to create the desired features in each layer of chip circuitry. The process requires the selective removal of hardened coatings (resists) from a wafer, leav...

An amorphous carbon film formed by a pyrolysis photoresist as the bottom contact source/drain electrode of OFETs to improve charge injection well device performance.

A high frequency ultrasonic technique has been developed to monitor photoresist processing in situ during semiconductor manufacturing. Photoresist pre-exposure bake and development have been monitored using the sensor, and the post-exposure bake has been studied as well. The in situ glass transition temperature (Tg ) was determined during the prebake for I-line films down to O.6im as well as fo...

In this work, the effect of ?-irradiation on adhesion properties FP9120 diazoquinone–novolac photoresist films deposited single-crystal silicon wafers by centrifugation was studied using an indentation method. It found that led to a decrease in specific peeling energy G silicon. case, IR spectra exhibited intensity vibration bands due Si–O–C moiety, which is responsible for silicon, course ?-ir...

A micromachined ridge gap waveguide power divider operating at 220–325 GHz is presented. The device fabricated by SUEX dry film photoresist. Dry photoresist can be used to obtain geometrical features with high accuracy using a robust fabrication process. designed has simple and wide band performance. measured transmission coefficients are equal −3.5 ± 0.4 dB the input reflection coefficient bel...

We demonstrate the possibility to image microstructures fabricated by two-photon polymerization (TPP) using coherent anti-Stokes Raman scattering (CARS) microscopy. The imaging contrast based on chemical selectivity attained by CARS microscopy is used to gather qualitative information on TPP. Upon the basis of detailed knowledge of the characteristic signatures of the photoresist Raman spectrum...

Microfiche has been used as the photomask in 1:1 contact photolithography to generate structures of photoresist with features as small as 10 μm. Optical reduction of images that were printed by a highresolution image setter on transparent polymer sheets generated patterns in microfiche. The photoresist patterns generated using microfiche as the photomask are useful in the fabrication of elastom...

In this study, we described the fabrication method for microfluidic channels with circular-cross sectional geometries by reflow phenomenon. The photoresist reflow leads to shape change from rectangular to semicircular, and we optimized the reflow conditions by using positive photoresist to form the perfect cylindrical micropatterns. The resultant circular micropattern was used as a template for...

In this article, we present a new method for fabricating precisely defined nanometer scale photoresist wire patterns. The Langmuir technique was utilized to form high aspect ratio lamellae, or wire patterns, of Ag nanocrystals at the air/water interface, and these patterns were transferred onto resist-coated substrates as a Langmuir–Schaeffer film and as a shadowmask. The wire patterns were tra...

We demonstrate plasmonic lithography with an optical contact probe to achieve high speed patterning without external gap distance control between the probe and the photoresist. The bottom surface of the probe is covered with a 10 nm thickness silica glass film for the gap distance control and coated with self-assembled monolayer (SAM) to reduce friction between the probe and the photoresist. We...