Sn–9Zn solder joints containing Ag nano particles were prepared by mechanically mixing Ag nano particles (0.3, 0.5 and 1 wt%) with Sn–9Zn solder paste. In the monolithic Sn–Zn solder joints, scallop-shaped AuZn3 intermetallic compound layers were found at their interfaces. However, after the addition of Ag nano particles, an additional uniform AgZn3 intermetallic compound layer well adhered to ...

Citation: Salerno M, Stępniowski WJ, Cieślak G, Norek M, MichalskaDomańska M, Karczewski K, Chilimoniuk P, Polkowski W, Jóźwik P and Bojar Z (2016) Advanced Image Analysis of the Surface Pattern Emerging in Ni3Al Intermetallic Alloys on Anodization. Front. Mater. 3:34. doi: 10.3389/fmats.2016.00034 advanced image analysis of the surface Pattern emerging in ni3al intermetallic alloys on anodization

A novel ball bond process optimization method based on a thermal signal from an integrated aluminum microsensor is reported. The in-situ temperature during the ball bonding is measured and analyzed. The ultrasonic period shows distinct features corresponding to the scrubbing of the ball on the pad and the intermetallic bond growth, and the ball deformation by ultrasonic softening. A peak of the...

In this paper the authors have investigated the thermal fatigue reliability of lead-free solder joints. They have focused their attention to the formation of the intermetallic compound and its effect on the initiation and propagation behaviors of fatigue cracks. Furthermore, they also studied the effect of voids in the solder joints on the fatigue reliability. An isothermal fatigue test method ...

In this study, an addition of Ag micro-particles (8–10 lm) with a content in the range between 0 and 1.5 wt.% to Sn–9Zn eutectic solder, were examined in order to understand the effect of Ag additions as the particulate reinforcement on the microstructural and mechanical properties as well as the thermal behavior of the newly developed composite solders. Here, an approach to prepare a micro-com...

in the present study, nanocrystalline ni50al50-xmox (x = 0, 0.5, 1, 2.5, 5) intermetallic compound was produced through mechanical alloying of nickel, aluminum, and molybdenum powders. alni compounds with good and attractive properties such as high melting point, high strength to weight ratio and high corrosion resistance especially at high temperatures have attracted the attention of many rese...

The solidification microstructures formed in a model 6082 alloy with 0.2–1.0 wt % Fe were examined under different cooling rates and the effects of 0.5 Mn Al–5Ti–1B grain refiner addition investigated. results compared against Thermo-Calc, differential scanning calorimetry (DSC) curve analysis. promotes primary-Al refinement from growth restriction constitutional undercooling but increases detr...

Ni-based under-bump metallization (UBM) has attracted wide attention due to its low reaction rate with Sn, compared with Cu and Cu alloy. In this study, the interfacial reactions between eutectic Sn–3.5Ag solder and Ni-based UBM, including electroplated Ni (EP-Ni) and electroless Ni (EL-Ni) are investigated. Morphology and growth kinetics of Ni3Sn4 intermetallic compounds are studied at differe...