the aim of this project is to fabricated an aluminium-copper bimetal through the fusion method and examine its performance. an aluminium-copper-aluminium bimetal was built by the laser cladding method. the laser power as well as the annealing time effects on its interfacial properties of the bonding’s formed through the laser cladding were investigated. to fabricate the multilayer bimetal, the ...

The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120◦C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the va...

A kinetic analysis was formulated for electromigration enhanced intermetallic evolution of a Cu–Sn diffusion couple in the Sn-based Pb-free solder joints with Cu under bump metallurgy. The simulated diffusion couple comprised the two terminal phases, Cu and Sn, as well as the two intermetallic phases, Cu3Sn and Cu6Sn5, formed between them. The diffusion and electromigration parameters were obta...

A diffuse-interface model of reactive wetting with intermetallic formation is presented. The model incorporates fluid flow, solute diffusion, and phase change that are based on the total molar Gibbs energy of a ternary system with four phases. Numerical simulations were performed successfully revealing the complex behavior of the reactive wetting process that include nucleation and growth of an...

Increasing environmental concerns and pending government regulations have pressured microelectronic manufacturers to find suitable alternatives to Pb-bearing solders traditionally used in electronics packaging. Over recent years, Sn-rich solders have received significant attention as suitable replacements for Pbbearing solders. Understanding the behavior of intermetallics in Sn-rich solders is ...

P. Pokorny, J. Kolisko, L. Balik – Czech Technical University – Klokner Institute, Prague, Czech Republic P. Novak – Institute of Chemical Technology, Prague, Czech Republic This review article mainly describes the composition of intermetallic Fe Zn, i.e. zeta (ζ), delta (δ1k + δ1p), gamma1 (Γ1) and gamma (Γ) on galvanized steel during low temperature galvanization (t ~ 450 °C). It gives detail...

There are several issues related to the mechanical and electrical wirebond failure during wirebonding process. Major factors are associated with AuAl intermetallic system. AuAl intermetallic compounds (IMC) can easily form at room temperature and can be accelerated with the elevated temperature. In this paper, pattern of intermetallic compounds growth and potential degradation due to voids in t...

Copper samples, hot solder (eutectic) dipped and thermally aged, were cross-sectioned and placed in an environmental scanning electronic microscope (ESEM). While in the ESEM the samples were heated for approximately 2.5 h at 170 degrees C to stimulate the growth of additional Cu/Sn intermetallic compound. The intent of the study was to obtain a continuous real-time videotape record of the diffu...

The study focuses on the critical interlayer thickness for averting pore formation during transient liquid phase (TLP) bonding in the Cu–Sn system. Such pores are a consequence of the growth and subsequent contact of Cu6Sn5 intermetallic grains on the two surfaces to be bonded, prior to the formation of the transient liquid phase. A criterion for the critical interlayer thickness is developed, ...