Abstract This review introduces relevant nanoscale thermal transport processes that impact abatement in power electronics applications. Specifically, we highlight the importance of mechanisms at each layer material hierarchies make up modern electronic devices. includes those through: (1) substrates, (2) interfaces and two-dimensional materials, (3) heat spreading materials. For layer, provide ...

The most critical challenge in today’s power electronics packaging is the interconnection technology. Inside the state-of-the-art power modules, interconnection of power devices is accomplished with wire bonds, which are prone to noise, parasitic oscillations, fatigue and eventual failure. Bond wires are the major contributors to the package’s resistance; approximately half of the total resista...

Itsy is a high-performance platform for research in “off-the-desktop” computing. One of the attributes of the base hardware is that it can easily be extended through the use of “daughter cards.” This technical note describes the packaging and electronics for one such extension: a simple CMOS camera.

This paper presents the progress in the development of a 4096 element MEMS deformable mirror, fabricated using polysilicon surface micromachining manufacturing processes, with 4μm of stroke, a surface finish of less than 10nm RMS, a fill factor of 99.5%, and bandwidth greater than 5kHz. The packaging and high speed drive electronics for this device, capable of frame rates of 22 kHz, are also pr...

Direct write (DW) of conductive materials in the context of Additive Manufacturing (AM) enables embedded electronics within fabricated parts. Previous works use manual, hybrid, and native material patterning systems to deposit conductive materials in parts fabricated by different AM technologies. This capability could eliminate cabled interconnects and redundant electronics packaging, resulting...

Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial inhstructure. [ 1,2] This is not true for MEMS with respect to packaging and testing. It is more difficult to adopt standardized MEMS device packaging for wide applications although MEMS use many similar technologies to IC packaging....