نتایج جستجو برای: czochralski technique

تعداد نتایج: 611832  

2005
K. A. Gable L. S. Robertson Amitabh Jain K. S. Jones

High-power arc lamp design has enabled ultrahigh-temperature sUHTd annealing as an alternative to conventional rapid thermal processing sRTPd for ultrashallow junction formation. The time duration of the UHT annealing technique is significantly reduced from those obtained through conventional RTP. This difference in time may offer the ability to maintain a highly activated ultrashallow junction...

پایان نامه :وزارت علوم، تحقیقات و فناوری - دانشگاه تربیت مدرس 1389

growing demands and requires of high data rate systems cause significant increase of high frequency systems for wideband communication applications. as mixers are one of the main blocks of each receivers and its performance has great impact on receiver’s performance; in this thesis, a new solution for ku-band (12-18 ghz) mixer design in tsmc 0.18 µm is presented. this mixer has high linearity a...

2000
V. V. Kalaev I.Yu. Evstratov E. M. Smirnov A. I. Zhmakin

Modeling of heat transfer is presented for the entire Czochralski Si-growth furnace. The axisymmetric steady-state approach with moving computational grids is used. Melt turbulent flow, inert gas flow, heat transfer in solid parts, and radiative heat transfer in the system are considered. The Reynolds-averaged Navier-Stokes equations written with the Boussinesq approximation and the energy equa...

2008
J. Härkönen E. Tuovinen P. Luukka E. Tuominen Z. Li A. Ivanov E. Verbitskaya V. Eremin A. Pirojenko I. Riihimaki A. Virtanen

We have processed pin-diodes and strip detectors on nand p-type high-resistivity silicon wafers grown by magnetic Czochralski method. The Czochralski silicon (Cz-Si) wafers manufactured by Okmetic Oyj have nominal resistivity of 900O cm and 1.9 kO cm for nand p-type, respectively. The oxygen concentration in these substrates is slightly less than typically in wafers used for integrated circuit ...

2005
R. Griesse

A free surface problem arising in the Czochralski (CZ) crystal growth process is considered. A mathematical model accounting for the interaction of the molten material with applied and induced magnetic fields, temperature-induced convection, rotating boundaries and a free surface is given. The model described avoids some common simplifying assumptions and allows for more general geometries, and...

2008
S. Ganschow D. Klimm P. Reiche R. Uecker

Attempts to grow terbium aluminium garnet (Tb3Al5O12, TAG) by the Czochralski method lead to crystals of millimeter scale. Larger crystals could not be obtained. DTA measurements within the binary system showed that TAG melts incongruently at 1840 ◦C. The perovskite (TbAlO3, TAP) with a congruent melting point of 1930 ◦C is the most stable phase in this system. The region for primary crystalliz...

2013
M. Umeno G. Hildebrandt

für Naturforschung in cooperation with the Max Planck Society for the Advancement of Science under a Creative Commons Attribution 4.0 International License. Dieses Werk wurde im Jahr 2013 vom Verlag Zeitschrift für Naturforschung in Zusammenarbeit mit der Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. digitalisiert und unter folgender Lizenz veröffentlicht: Creative Commons Namen...

2009
D. Macdonald F. Rougieux A. Cuevas B. Lim J. Schmidt M. Di Sabatino L. J. Geerligs

Czochralski silicon D. Macdonald, F. Rougieux, A. Cuevas, B. Lim, J. Schmidt, M. Di Sabatino, and L. J. Geerligs Department of Engineering, College of Engineering and Computer Science, The Australian National University, Canberra ACT 0200, Australia Institut für Solarenergieforschung Hameln (ISFH), Am Ohrberg 1, D-31860 Emmerthal, Germany SINTEF Materials and Chemistry, A. Getz v. 2B, 7465 Tron...

Journal: :Izvestiya Vysshikh Uchebnykh Zavedenii. Materialy Elektronnoi Tekhniki = Materials of Electronics Engineering 2018

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