Wafers with smooth Au thin films (rms surface roughness: < 0.5 nm, thickness: < 50 nm) were successfully bonded in ambient air at room temperature after an Ar radio frequency plasma activation process. The room temperature bonded glass wafers without any heat treatment showed a sufficiently high die-shear strength of 47–70MPa. Transmission electron microscopy observations showed that direct bon...

VALÁŠEK PETR, MÜLLER MIROSLAV. 2016. Possibilities of Adhesives Filling With Micro-particle Fillers – Lap-shear Tensile Strength. Acta Universitatis Agriculturae et Silviculturae Mendelianae Brunensis, 64(1): 195–201. An adhesive bonding can be ranged among technologies of materials bonding which are used in all industrial branches. It plays its important role also in an area of the constructio...

Relaxed, high Ge content SiGe layers have been realized using stress balance on a compliant borophosphorosilicate glass (BPSG). A 30-nm fully-strained Si0.7Ge0.3 layer was transferred onto a 1 μm BPSG film by wafer-bonding and Smart-cut processes, after which the continuous Si0.7Ge0.3 film was patterned into small islands to allow for lateral expansion. After the strain in Si0.7Ge0.3 islands wa...