Deep brain stimulation therapies for Parkinson’s disease utilize hardware, which from a packaging perspective, resembles that used in cardiac pacemakers. A hermetic package that contains stimulation electronics and a primary battery supply is implanted under the scalp in a recess cut into the skull. Stimulation probes, each with up to four electrodes, are inserted into the brain and connected t...

More recently, there has been a growing trend toward making electronics fl exible and even stretchable, [ 1–7 ] e.g., in the applications of neural interfaces where mechanical compliance is critical. [ 8–12 ] Many challenges hinder the implementation of electronics on an elastomeric substrate with integration density and functionality comparable to that achievable on a silicon substrate. One ma...

Electronics packaging evolution involves both architectural and technology considerations. In this paper, we present the design and measurements of Single-Input-SingleOutput (SISO) dual-band filters operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, using the novel ”dual behavior resonators” technique. The filters have been fabricated using Low Temperature Co-fired Ceramic (LT...

In the expanding world of modern electronics and integrated circuits, the need for high-density, highperformance electronic circuit packaging is paramount. Key to any successful electronic packaging activity is the ability to model and analyze electrical, mechanical, and thermal system behavior before actual system design and fabrication. Details of an APL-developed set of computer-based models...

We present a new packaging solution for GaN power electronics for efficient heat extraction needed for high power devices. The benefits of using silver diamond composite as base plate in packages for GaN power bars is demonstrated. A dramatic improvement in thermal management (as high as ~50%) was obtained with respect to the existing packaging technologies based on CuW. Micro-Raman thermograph...

From the history of power electronics, the technology improvements in power semiconductors have been the driving force for this problem. Moving from bipolar to MOSFET technology has greatly increased switching speed. For current semiconductor technology, very fast devices are available. For the power MOSFET used in front end application, they could be switched with mega hertz frequency range. T...