Nowadays, faults and failures are increasing especially in complex systems such as Network-on-Chip (NoC) based Systems-on-a-Chip due to the increasing susceptibility and decreasing feature sizes. On the other hand, fault-tolerant routing algorithms have an evident effect on tolerating permanent faults and improving the reliability of a Network-on-Chip based system. This paper presents reliabili...

This paper appraises two major chip formation techniques in finite element (FE) simulation of machining. The first one considers chip formation as a wedge indentation process, while the second one considers chip separation due to ductile fracture. The first technique has been implemented in an Arbitrary Lagrangian-Eulerian (ALE) simulation of machining and the chip formation is assumed to be du...

The industrial demand for automated machining systems to enhance process productivity and quality in machining aerospace components requires investigation of tool condition monitoring. The formation of chip and its removal have a remarkable effect on the state of the cutting tool during turning. This work presents a new technique using acoustic emission (AE) to monitor the tool condition by sep...

The paper describes micro structural observation (LM and SEM), which has been made on quick-stop sectioned samples of the chip formation, either on metals (high-speed steels) and Ti3SiC2 ceramic. All milling tests were carried out using a “quick-stop” method developed by the authors. For micro structural analysis samples were prepared by standard metallographic technique and examined with a lig...

Three-dimensional (3D) packaging with through-silicon-vias (TSVs) is an emerging technology featuring smaller package size, higher interconnection density, and better performance; 2.5D packaging using silicon interposers with TSVs is an incremental step toward 3D packaging. Formation of TSVs and interconnection between chips and/or wafers are two key enabling technologies for 3D and 2.5D packag...

The advent of chip calorimetry has enabled an unprecedented extension the capability differential scanning to explore new domains materials behavior. In this paper, we highlight some our recent work: application heating and cooling rates above 104 K/s allows for clear determination glass transition temperature, Tg, in systems where Tg onset temperature crystallization, Tx, overlap; evaluation d...