نتایج جستجو برای: soldering alloy

تعداد نتایج: 54605  

2013
Guofeng Cui Shaofang Liu Jie Zhao Edward F. Holby Qing Li Gang Wu

Eutectic AuSn20 solder is an important material for electronic packaging technology due to its superior mechanical and thermal conductive properties. In this work, AuSn20 alloy films are prepared via the electrodeposition method for the first time. The electrodeposition is cost-effective with improved control over the alloy content when compared to traditional powdered metallurgy methods. Pyrop...

2003
Ken Gilleo

early a million years ago, mankind’s technological march through time beN gan after fire was mastered. Metalworking, which evolved into metallurgy, is the oldest and most successful technology. It spans at least 12,000 years (Figure 1). Soldering, a key metal joining technology, was probably developed about 7,000 years ago when lower melting, naturally occurring metal alloys were placed in the ...

1999
X. Q. Shi Z. P. Wang

Surface mount technology (SMT) is increasingly used in microelectronics to mount components by soldering onto the printed circuit board (PCB). The solder alloys are used as the electrical and mechanical connections between the component and the board. Fatigue failure of solder joints is recognized as a major cause of failure in electronic devices. An approach to this problem is to determine the...

2014
Soon-Yong Kwon Yong Kim Hyo-Won Ahn Ki-Beom Kim Kyu-Rhim Chung Seong-Hun Kim Sunny

The availability of 3D dental model scanning technology, combined with the ability to register CBCT data with digital models, has enabled the fabrication of orthognathic surgical CAD/CAM designed splints, customized brackets, and indirect bonding systems. In this study, custom lingual orthodontic appliances were virtually designed by merging 3D model images with lateral and posterior-anterior c...

2001

What automated soldering methods can be considered for Mini-Circuits surface-mount components? There are two basic methods: reflow and wave soldering. Generally, reflow soldering can be done when (l) there are only surface mount components, or (2) these are present together with through-hole components and the latter will be soldered in a separate (wave soldering) step. The surface-mount compon...

Journal: :QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 1997

Journal: :JCP 2010
Chung-Chi Wu Yung-Nan Hu

In the study, embedded BASIC Stamp 2 (BS2) microchip controller is used to design with Hopfield neural network (HNN) as the foundation of sample training, which applies for a soldering platform of mechanical vision and accomplishes PCB soldering positioning technology. The proposed system design method in this paper can be divided into two parts: 1) the control rules of RC servo motor is design...

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