An AlGe eutectic wafer level bonding process is presented and characterized for heterogeneous integration of silicon photonics, CMOS integrated electronic circuits and active III-V components. Heterogeneous Integration of Photonics and CMOS The technology of silicon photonics integrated circuits (SiPIC) currently finds itself transitioning from research to industrial scale production [1]. The p...

Imaging ellipsometry was combined with electrochemical methods for studying electrostatic interactions of protein and solid surfaces. The potential of zero charge for gold-coated silicon wafer/solution interfaces wad determined by AC impedance method. The potential of the gold-coated silicon wafer was controlled at the potential of zero charge, and the adsorption of fibrinogen on the potential-...

Silicon photonics shows tremendous potential for the development of the next generation of ultra fast telecommunication, tera-scale computing, and integrated sensing applications. One of the challenges that must be addressed when integrating a "photonic layer" onto a silicon microelectronic circuit is the development of a wafer scale optical testing technique, similar to that employed today in ...

In RF-MEMS packaging, next to the protection of movable structures, optimization of package electrical performance plays a very important role. In this work, a wafer-level packaging process has been investigated and optimized in order to minimize electrical parasitic effects. The package concept used is based on a wafer-level bonding of a capping silicon substrate with throughsubstrate intercon...

We have designed, fabricated, and characterized two-dimensional 16x16-element capacitive micromachined ultrasonic transducer (CMUT) arrays. The CMUT array elements have a 250-μm pitch, and when tested in immersion, have a 5-MHz center frequency and 99% fractional bandwidth. The fabrication process is based on standard silicon micromachining techniques and therefore has the advantages of high yi...

MEMS is an acronym for Microelectro Mechanical Systems, it defines mechanical structures fabricated with IC processing on (most often) silicon wafers. In Europe, MEMS is labeled Microsystems and in Japan it is labeled Micromachines. The term MEMS evolved in the United States in the 1990s. Prior to that period the technology was labeled silicon micromachining . MEMS defines the technology; not s...

This paper reports a microelectromechanical systems (MEMS) resonant varifocal mirror integrated with piezoresistive focus sensor. The varifocal mirror is driven electrostatically at a resonant frequency of a mirror plate to obtain the wide scanning range of a focal length. A piezoresistor is used to monitor the focal length of the varifocal mirror. The device is made of a silicon-on-insulator (...