This letter demonstrates that features embossed on the surface of a layer of photoresist can direct UV light in the photoresist layer. These topographical features act as optical elements: they focus/ disperse and phase shift incident light in the optical near field, inside the resist layer. A number of different surface topographies have been examined, which give 50–250 nm features after expos...

The aim of this contribution is the application of matrix-assisted laser desorption/ionization mass spectrometric imaging (MALDI-MSI) in the area of photolithographic structuring. As proof of concept, this method was used to image an UV exposed negative photoresist layer, which is generally used to manufacture printed circuit boards (PCB) for electronic components. The negative photoresist laye...

A deep ultraviolet plasmonic structure is designed and a surface plasmon interference lithography method using the structure is proposed to generate large-area periodic nanopatterns. By exciting the anti-symmetric coupled surface plasmon polaritons in the structure, ultrahigh resolution periodic patterns can be formed in a photoresist. The resolution of the generated patterns can be tuned by ch...

Grayscale mask creation has for the most part been restricted to over-simplified optical and resist models usually based on a contrast curve approach. While this technique proven work microstructures of large dimensions (ten hundreds micrometers), its capability not assessed with smaller dimensions. In paper, rigorous lithographic model developed in Python simulate process imaging, exposure dev...

3D packaging solutions are expected to play an important role in delivering improved performance, smaller form factors, and reduce costs for advanced semiconductor devices. The physical stacking of die-to-die or die-to-wafer requires high interconnect density. Aggressive scaling of microbump diameters and pitch is essential to meet these interconnect requirements. Maintaining process control fo...

OF THE THESIS DNA Attachment to Pyrolyzed Carbon Electrodes for Bionanoelectronics Platforms by Mieko Hirabayashi Masters of Science in Bioengineering: Bioinstrumentation San Diego State University, 2012 Research to understand the electrical properties of DNA as an electrical component continues with the objective of determining the use of DNA as the next generation nanoelectronics component. T...

Two-photon polymerization, based on two-photon absorption, is a convenient direct laser writing process to fabricate maskless structures in microand nanometer range with submicrometer resolution. Negative photoresists are used in combination with this technique, however, utilization of positive resists with two-photon absorption is very innovative. Due to less shrinkage and economic manufacturi...

There are two critical parameters for microbolometers: the temperature coefficient of resistance (TCR) of the sensing material, and the thermal conductance of the insulation structure. Cytochrome c protein, having a high TCR, is a good candidate for infrared detection. We can use SU-8 photoresist for the thermal insulation structure, given its low thermal conductance. In this study, we designed...

Submicron Deep Ultraviolet (DUV) photolithographic processes present significant manufacturing challenges due to the relatively small process windows often associated with these technologies. The sensitivity of the process to small upstream variations in incoming film reflectivity, photoresist coat and softbake steps as well as the bake plate temperature can result in the final critical dimensi...