Worldwide many attempts are taken to improve lifetime and power cycling capability of wire bonded IGBT modules. But even in very conservative inverter designs overload conditions may occur and cause damage to the inverter. In addition it is a fact that even the best design will reach its "end of life"

The emitter (front metallization) of IGBTs is contacted by wire bonding. In this study, the influence of the wirebond layout on the power cycling performance of IGBT modules is investigated. Stitch bonding is implemented to modify the wirebond layout of the emitter contact. The different layouts are subjected to power cycling tests. For a better understanding of the experimental results, electr...

In this paper, a new three-phase four-wire distribution static compensator (DSTATCOM) based on a T-connected transformer and a three-leg voltage source converter (VSC) is proposed for power quality improvement. The T-connected transformer connection mitigates the neutral current and the three-leg VSC compensates harmonic current, reactive power, and balances the load. Two single-phase transform...