BACKGROUND Studies have shown a reduction in bond strength of composites and glass ionomer to bleached enamel and dentin. Several methods have been proposed to reverse compromised bond strength. OBJECTIVE The aim of this study was to evaluate the effect of delayed bonding and application of antioxidant agent on the bond strength of reinforced self-cured (Fuji IX) and light-cured glass ionomer...

An anisotropic conductive adhesive (ACA) bump was produced on a silicon chip for bonding onto a glass substrate. The bumping process and the bonding procedure are described. The constituents of the ACA were investigated with a scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). The thermal behavior of the ACA was investigated with differential scanning calorimetry (DSC)...

To investigate an amorphous structure of Ge(2)Sb(2)Te(5) that satisfies the 8-N rule (so-called 'ideal glass'), we perform alternative melt-quench simulations on Si(2)As(2)Se(5) and replace atoms in the final structure with Ge-Sb-Te. The resulting structures have salient features of the 8-N rule such as the tetrahedral configuration for all Ge atoms and the localized Te lone pairs at the valenc...

Pressure-tolerant polymer-glass microfluidic reactors with excellent bonding strength have been fabricated by the simultaneous solidification-bonding (SSB) method, in which a viscous and reactive matrix polymer was cast on the glass substrate with pre-patterned wax as a sacrificial template. Elaborate interfacial chemistry between the matrix polymer and the functionalized glass surface was desi...

Ddferent r f-sputtered borosdlcate glass films are characterized Layers sputtered m 100% AI and annealed m Nz at 550 “C for 3 5 h are found to be best applicable as protection layers m amsotropx etchmg of SI m KOH solutions and as bondmg layers m s&on mlcromachmmg For m SUB mspection of the progress of the dxonto-&con anodlc bondmg process usmg sputtered glass as mtermedlate layer, an Infrared ...

A simple method, using only neutral detergent for surface cleaning, produces reversible glass–glass bonding to enable use of a glass microfluidic device repeatedly and switching microchannel from closed cell cultivation open recovery.

As a microassembly and an encapsulation technique, wafer bonding offers a unique opportunity to combine different materials. Transmission laser bonding not only can satisfy wafer level bonding requirements, but can also be directly implemented into the existing automatic semiconductor fabrication line. In this paper, a laser-induced wafer bonding technique for micro-electro-mechanical systems (...

Oxynitride glasses are found as grain boundary phases in silicon nitride ceramics. They are effectively alumino-silicate glasses in which nitrogen substitutes for oxygen in the glass network, and this causes increases in glass transition and softening temperatures, viscosities (by two to three orders of magnitude), elastic moduli and microhardness. Calcium silicate-based glasses containing fluo...

Wafer bonding has been widely used for forming vacuum and hermetic packages for MEMS devices. Several techniques, including anodic silicon-glass, silicon-silicon fusion, metal compression, glass frit, eutectic, and solder bonding have been attempted and some have been demonstrated successfully. Solders have some advantages that make them an interesting area of research for wafer bonding. They o...