The present study outlines the use of Taguchi parameter design to minimize the wear performance of electroless Ni-B coating by optimizing the tribological testing parameters. The tests are carried out in a multitribotester and the three parameters viz. load (L), speed (S) and time (T) are considered with three levels each. An L27 array is used to accommodate the three factors as well as their i...

the effect of an electroless ni-cu-p coating on the fatigue behavior of quenched and tempered ck45 steel has been investigated. the fatigue tests under rotating bending conditions have been conducted in three different conditions of uncoated, as-deposited and shot peened prior to the coating deposition. the results indicate that plating of the base steel leads to a fatigue life reduction. the d...

In this study, electroless Ni-B depositions were achieved on the St-37 steel substrates at different NaBH4 concentrations and 950 oC 1 hour. Electroless deposited samples had a cauliflower-like surface texture that makes lubricating naturally as concentration increased, grain size decreases in microstructure. XRD spectra of sample showed partial amorph region together with crystalline region. M...

This work relates to wafer bumping technologies for flip chip packaging applications in the electronics industry. Nickel and its alloys are alternative under bump metallization (UBM) materials because of their slower reaction rates with Sn-based solder as compared to Cu-based UBMs. In this study, we compared the morphologies of the intermetallic compounds (IMC) formed between Sn-bearing solders...

Thermo-mechanical reliability of the solder bumped flip chip packages having underfill encapsulant was evaluated with thermal shock testing. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 IMC layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and electroless Ni-P layer of the package side. ...

By restricting the dilated deformation, surface modification can stimulate multiple shear banding and improve the plasticity of bulk metallic glasses (BMGs). Aimed at modifying the surface of BMGs by thin layers, a crystalline Ni coating with ultrafine grains was coated on the surface of a Ti-based BMG by electroless plating. With a thickness of about 10 μm, the prepared thin coating could effe...

Hybrid Ni/Al foams were fabricated by depositing electroless Ni-P (EN) coatings on open-cell Al foam substrate to obtain enhanced mechanical properties. The microstructure, chemical components and phases of the hybrid foams were observed and analyzed by scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS) and X-ray diffraction (XRD), respectively. The mechanical proper...

nicu alloy nanowires arrays were embedded into the anodic aluminum oxide (aao) template by ac-pulse electrodeposition. different off-time were used in electrolyte with constant concentration of ni and cu and acidity of 3. the effect of deposition parameters on alloy contents was investigated by studying the microstructure and magnetic properties of as-deposited nicu alloy nanowires. atomic forc...