This paper presents an overview of recent state of the art technologies and future trends in millimeter-wave MMIC packaging in the aspects of low cost, high productivity and high functionality. Developments of ceramic packages up to W-band have been progressed by design innovation. LTCC Technology with thick film printing has realized low-cost packages and 60GHz-band antenna integrated MCMs. Mu...

Those in organisations tend to adopt new technologies as a way to improve their functions, reduce cost and attain best practices. Thus, technology promoters (or vendors) work along those lines in order to convince adopters to invest in those technologies and develop their own organisations profit in return. The possible resultant ‘conflicts of interest’ makes the study of reasons behind IT diff...

This paper will detail the design and manufacturing elements of near hermetic air cavity packages produced by injection molding of low moisture diffusivity polymers. The R-Pak process uses a patented sealing methodology to take maximum advantage of the properties of the starting polymeric material. The material properties and advantages will be presented. The very low moisture diffusivity of th...

INTRODUCTION In 2003/4 the Information Management Research Institute, Northumbria University, conducted a research project to identify the barriers to e-learning for health professionals and students. The project also established possible ways to overcome these barriers. The North of England Workforce Development Confederation funded the project. METHODOLOGY The project comprised a systematic...

INTRODUCTION The Fairchild 8x8 DriverMOS package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power related products due to its low package height, excellent thermal performance with large thermal pads in the center of the package which solder directly to the printed wiring board (PWB) and allow modularity in package design,...

INTRODUCTION The Fairchild Dual Power56 package is based on Molded Leadless Packaging (MLP) technology. This technology has been increasingly used in packaging for power related products due to its low package height, excellent thermal performance with large thermal pads in the center of the package which solder directly to the printed wiring board (PWB). Modularity in package design, single an...

Abstract Humbang Hasundutan District is the 9th rice producer in North Sumatra and has opportunity to increase productivity from 2019 harvest area of 16.3 thousand hectares, which can contribute 68.2 tons. This potential still be increased if there a significant change attitude technology adoption. Based on results interviews with several farmers who have ≥ 10 years experience farming District,...

Standard application packages are used to improve business processes and to reduce costs for information systems. Standard application packages in the form of ERP systems (Enterprise Resource Planning systems) are common among private sector organizations. Public sector organizations use standard application packages developed for specific areas of government operations. Today, the design, use ...