The aim of the research work was to characterize soldering alloy type Bi-Ag-Ti and study direct silicon copper. Bi11Ag1.5Ti solder has a broad melting interval. Its scope depends mainly on content silver titanium. begins melt at temperature 262.5 ?C full is completed 405 ?C. microstructure consists bismuth matrix with local eutectics. crystals titanium phases as BiTi2 Bi9Ti8 are segregated in m...

The main joining process of the electronic industry is still soldering with different alloys Sn. This work studied relationship between Sn whisker growth and corrosion resistance 99Sn0.3Ag0.7Cu–TiO2/ZnO (0.25wt%) composite solder in a corrosive environment via scanning electron microscopy focused ion beam techniques. test showed that application TiO2 ZnO nano-particles almost totally suppressed...

Eutectic Sn–Pb is historically the most important solder alloy, thus its reactions will serve as relevant references for Pb-free solder substitutes. Here, an investigation has been carried out to compare the dissolution kinetics of the Cu pad of the ball grid array (BGA) substrate with the molten conventional eutectic Sn–Pb solder having different volumes. BGA solder ball of 760 and 500 m of di...

Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So far, many papers have reported effects of cooling speed, type of solder pastes and solder fluxes o...

In the electronics manufacturing industry, soldering plays a key role in the process, whether it is carried out manually, semi-automatically or fully automatically. Even though the basic techniques in manual soldering are comparatively straightforward, to master it at a high level still requires a lot of time and effort. The research presented in this paper aims to identify the motor skills inv...

Over recent years the electronics manufacturing industry has seen a shift away from wave soldering towards reflow soldering [1]. However, although wave soldering is indeed mature (first used during the 1950’s [eg 2]), there is still significant activity with novel process development to match [3]. This paper concerns a new type of noclean liquid flux for wave soldering that is based on water [4...