Area selective deposition via atomic layer (ALD) has proven its utility in elementary nanopatterning processes. In the case of complex 3D patterned substrates, processes lead to vertical sidewall coverage only, or top and bottom horizontal surface enable advanced further miniaturization microelectronic devices. While many fabrication strategies for only Topographically Selective Deposition (TSD...

Abstract Atomic layer deposition (ALD) is a thin-film fabrication technique that has great potential in nanofabrication. Based on its self-limiting surface reactions, ALD excellent conformality, sub-nanometer thickness control, and good process compatibility. These merits promote the industrial research applications of various fields. This article provides an introduction to highlights semicond...