This study presents an electrical current testing that is based on the Sn­xAg­0.5Cu (x = 1, 3mass%) photovoltaic (PV) ribbon, and investigates the growth mechanism of the intermetallic compounds (IMCs). The microstructure of both alloy solders contains the eutectic region (¢-Sn+Cu6Sn5+Ag3Sn) and the base phases (¢-Sn). The eutectic phases in the Sn­3Ag­0.5Cu (SAC305) alloy presented a continuou...

Legislation is being developed worldwide to reduce the lead content in many consumer electronic products. This is being taken as an action to reduce environmental impact when such products are discarded. Despite the fact that lead containing solders in electronic assemblies account for only 0.49% of world lead consumption, the trend in legislation will likely be to require not only reduced lead...

The Bi–In–Sn–Zn system is an important alloy system in lead-free soldering. Thermodynamic descriptions for the ternary systems Bi–In–Sn, Bi–In–Zn, Bi–Sn–Zn and In–Sn–Zn are optimized, using the CALPHAD method and combined to obtain a description of the quaternary Bi–In–Sn–Zn. All available experimental data from the literature are taken into consideration in the optimization. Calculated liquidi...

Di€erent doses of high-energy Si (0.2±4.5 MeV) were implanted in polycrystalline Au foils (35 lm thick) to form a low melting point Au±Si alloy which can be used for gold soldering. A Au±Si eutectic structure has been observed in the implanted Au foils after annealing at 400°C for 1 h. The Au±Si liquid phase was di€used in the polycrystalline Au foil along the grain boundaries which were ̄atten...

Introduction: The process of mixing metals with non metals is called alloying, and the resulting mixture alloy. Alloys are composed of at least two elements, from which one must be metal. They are divided into alloys for fixed partial dentures-FPD (golden, golden-platinum, silver-palladium alloys, alloys for soldering and alloys for metal-ceramic dentures). Purpose: the main purpose is to inves...

Abstract Commercially known as Innolot, the highly reliable lead-free alloy, allowing for high operating temperatures, is a Tin-Silver-Copper (SAC) metallurgical system with additional elements to harden alloy and improve its creep strength in order significantly reliability of solder joints. Compared traditional SAC alloys, characteristic lifetime can be enhanced on base temperature cycle test...

Abstract Social distancing measures due to the SARS-CoV-2 virus have profoundly challenged educational experimental work. We sought remediate this issue by designing a series of low cost, risk, quick, and qualitative electrochemistry corrosion experiments be performed in student’s homes at microscale with kit provided teacher. One such experience is electroplating Sn from an aqueous chloride so...