In this paper, a novel single-chip MEMS capacitive microphone is presented. The novelties of this method relies on the moveable aluminum (Al) diaphragm positioned over the backplate electrode, where the diaphragm includes a plurality of holes to allow the air in the gap between the electrode and diaphragm to escape and thus reduce acoustical damping in the microphone. Spin-on-glass (SOG) was us...

In micromachining, the quasi-intermittent vibration—assisted swing cutting technology alleviates residual height problem of elliptical vibration–assisted (EVC) and inherits its intermittent machining characteristics. The minimum chip thickness has a significant impact on forces, tool wear, process stability when working with difficult-to-machine materials. This study thoroughly examines paramet...

In this paper, uniform and variable edge microgeometry design inserts are utilised and tested for 3D turning process. In 3D tool engagement with workpiece, thickness of the chip varies from a maximum equal to the feed rate (at primary cutting edge) to a minimum on the tool’s corner radius (at trailing cutting edge). The ideal tool edge preparation should posses a variable configuration which ha...

Chip Solder Joints Y. L. Lin, W. C. Luo, Y. H. Lin, C. E. Ho, and C. R. Kao Department of Chemical & Materials Engineering National Central University Jhongli City, Taiwan (*E-mail: [email protected] Phone/Fax: +886-3-4227382) Abstract The effects of Au thickness on the flip chip solder joints with the Cu/Ni/Al UBM on one end and the Au/Ni surface finish on another was studied. Two different th...

By increasing, the complexity of chips and the need to integrating more components into a chip has made network –on- chip known as an important infrastructure for network communications on the system, and is a good alternative to traditional ways and using the bus. By increasing the density of chips, the possibility of failure in the chip network increases and providing correction and fault tol...

The design, materials, process, and fabrication of a hybrid substrate for the heterogeneous integration chips with 50μm-pitch (minimum) by fan-out chip-last panel-level packaging are presented. consists fine metal linewidth (L), spacing (S), thickness (H) RDL (redistribution-layer) substrate, solder joints underfill, build-up package substrate. dielectric material L/S/H RDL-substrate is an Ajin...

Tool wear, minimum chip thickness and micro tool geometry are found to have a significant influence on the surface roughness through experimental analysis of the micro-end-milling process. To address these issues, a surface roughness model is developed and validated in this present work. Firstly, experimental analysis for the tool wear and surface roughness was performed based on the micro-end-...

This paper presents an investigation of the mechanism of the brittle–ductile cutting mode transition from the perspective of the mechanics. A mechanistic model is proposed to analyze the relationship between undeformed chip thickness, deformation, and stress levels in the elastic stage of the periodic chip formation process, regarding whether brittle or ductile mode deformation is to follow the...