There are several issues related to the mechanical and electrical wirebond failure during wirebonding process. Major factors are associated with AuAl intermetallic system. AuAl intermetallic compounds (IMC) can easily form at room temperature and can be accelerated with the elevated temperature. In this paper, pattern of intermetallic compounds growth and potential degradation due to voids in t...

The growth kinetics of intermetallic compound (IMC) layers formed between Sn-3Ag-6Bi-2In ball-grid-array (BGA) solder and Au/Ni/ Cu substrate by solid-state isothermal aging were examined at temperatures between 343 and 443K for 0 to 100 days. A quantitative analysis of the IMC layer thickness as a function of time and temperature was performed. The intermetallic layer exhibited a parabolic gro...

The influences of Er content on the interfacial microstructure shear properties and creep Sn58Bi joints were investigated in this study. intermetallic compound composition Sn58Bi-xEr/Cu was Cu6Sn5 compound. addition suppressed activity Sn element, decreased driving force for growth thickness layer. durability welded improved to a certain extent. At 0.1%, strength solder alloy are relatively opt...

In the present study, nanocrystalline Ni50Al50-xMox (X = 0, 0.5, 1, 2.5, 5) intermetallic compound was produced through mechanical alloying of nickel, aluminum, and molybdenum powders. AlNi compounds with good and attractive properties such as high melting point, high strength to weight ratio and high corrosion resistance especially at high temperatures have attracted the attention of many rese...

In this paper, the effect of Ni on the formation of Cu6Sn5 and Cu3Sn intermetallics between tin and (Cu,Ni)-substrates has been studied by making use of the thermodynamic assessment of the Sn-Cu-Ni system. The driving forces for the diffusion of the elements in the intermetallic layers were calculated as a function of Ni-content. Assuming constant mobilities of component atoms, the results sugg...

In order to accelerate the growth of interfacial intermetallic compound (IMC) layers in a soldering structure, Cu/SAC305/Cu was first ultrasonically spot soldered and then subjected to isothermal aging. Relatively short vibration times, i.e., 400 ms and 800 ms, were used for the ultrasonic soldering. The isothermal aging was conducted at 150 °C for 0, 120, 240, and 360 h. The evolution of micro...