نتایج جستجو برای: glass bonding

تعداد نتایج: 114585  

2006
Shuji Tanaka Satoshi Fujimoto Osamu Ito Seong-Hun Choe Masayoshi Esashi

This paper reports a novel method to produce high density feedthrough glass wafers with sufficient thickness for the packaging and interconnection of high density array micro electromechanical systems (MEMSs). Pyrex glass wafers with thin film metal lines on the surface are stacked and bonded with each other using phenyl methyl siloxane-based adhesive. The stacked glass wafer block is then slic...

2012
Kihoon Jang Chenxi Wang Yan Xu Takehiko Kitamori

We developed room-temperature bonding of micro-nanofluidic device using fluorine induced plasma activation method. Fluorine was induced by O2 reactive ion etching (RIE) plasma treatment with Teflon Pieces which increased the bonding strength between fused silica glass substrates. The room-temperature bonded fused silica glass micro-nanofluidic device had high bonding strength as well as could w...

Journal: :journal of dental school, shahid beheshti university of medical sciences 0
n panahandeh dept. of operative dentistry, dental school, shahid beheshti university of medical sciences, tehran, iran. m sheikholeslamian dept. of operative dentistry, dental school, alborz university of medical sciences, alborz, h farzaneh

objective: microleakage has always been a problem in restorative dentistry. to decrease microleakage, modern bonding systems, different application methods and sandwich technique have been recommended. the purpose of this study was to assess the microleakage in class v cavities restored with open sandwich technique using self-etch and total-etch bonding systems.   methods: in this in vitro stud...

2007
S. G. Serra A. Schneider K. Malecki S. E. Huq W. Brenner

This paper describes a simple process of adhesive bonding between a glass lid and a SU-8 microfluidic device. The bonding is made by applying pressure, between 1.24 MPa – 3.72 MPa, and heat above the SU-8 glass transition temperature (Tg). The advantages of this process are low cost, simplicity and no need of extra adhesive material, which could block microchannels and inlets. The SU-8 microcha...

2015
Yen-Huei Lai Wan-Tsang Wang Keh-Long Hwu Hsueh-Hsing Lu Lee-Hsun Chang Yu-Hsin Lin

Anisotropic conductive film (ACF) has been used for more than 30 years in flat panel display (FPD) module package. In this paper, the technical trends and development of ACF are described. Among all of them, ACF material design for flexible substrate bonding is critical for the development of flexible display. According to different process flow of flexible AMOLED, flexible substrate bonding te...

Hila Hajizadeh Nasrin Sarabi Saied Mostafa Moazzami, Sara Majidinia

Introduction: The aim of the present study was to evaluate the effect of glass ceramic insert in the sandwich technique to reduce microleakage in class II composite resin restorations. Methods: Sixty sound human upper second premolars were selected and randomly divided into six groups (n=10). Class II box-only cavities were prepared in distal aspects of each tooth with gingival margin located a...

2015
Tilo Köckritz Tom Schiefer Irene Jansen Eckhard Beyer

This article examines the development of a laser pretreatment method for glass fibre reinforced polypropylene surfaces for industrial applications. This work aims to create a reproducible surface for bonding low-energy polypropylene which adheres very poorly to most adhesives and forms to the matrix material for plastic composites. The combination of glass fibres with polypropylene in the form ...

2017
Daisuke YAMASHITA Hideo SATO Motoharu MIYAMOTO

The aim of this study was to deyelop a noyel hydroxyapatite (HA) coating method on zirconia using glass coating technique. A borosi)icate glass, the mixture of the glass ttnd HA (3e, 50, 70, and 90 mass%), and the 100% HA were coated on two kinds of zirconia discs and fired at 900-950'C. After the final coating, the surface of the sample was etched for 3 min in an acid-mixture of 3% HF and 5%HN...

2004
M. Wiemer J. Frömel T. Gessner

Effective and cost favorable procedures for hermetical encapsulation of MEMS-structures on wafer level can be fabricated by wafer bonding technologies like the seal glass bonding and by suitable connection technologies routing the electrical potential through the chip structure. Within the paper the parameters of the print and bonding process will be presented and the print process limits will ...

2011
M. Enamul Hossain

The usages of the composite materials range from simple household to light-to-heavy industrial purposes including oilfield applications. The objective of this study is to evaluate current and potential uses of composite materials for the petroleum industry. This article gathered all the available composite materials that are normally used specially in oilfield and surface pipeline applications....

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