Heading for a largely improved interface between individuals and electronics this paper presents enabling technologies for the integration of electronics into textile fabrics. For the realization of ‘wearable electronics’ we discuss a packaging and interconnect technology, a silicon-based micro-machined thermoelectric generator chip for energy harvesting from body heat, and an interwoven antenn...

AuSi, patterned Au and off-eutectic Sn-Au-Sn die attach materials and processes have been investigated for SiC die attach for high temperature applications. AuSi shear test results after 3000 hours of aging at 325C in air showed only a slight decrease in shear strength when assembled on Mo:Mn/Pd/Au metallized AlN. However, when assembled on Mo:Mn/Ni/Au metallized AlN, the die shear strength dec...

k thermal conductivity, W/mK An analytical model is developed for predicting constriction and spreading resistances associated with heat transfer from various electronic components under different modes of cooling. The model assumes a heat source in contact with a larger cold plate which is in turn cooled with a convective heat transfer coefficient specified over the sink surface. Unlike existi...

Driven by the exploding popularity of the Internet-of-Things (IoT), the demand for thin, flexible, lightweight intelligent sensing devices is growing rapidly. Two attractive examples are intelligent packaging and wearable healthcare monitoring devices, which help to connect and track / monitor everything / everybody at any time and in any place. The remarkably swift development of flexible and ...

Keywords: Power electronics High temperature Shear Creep Nano-indentation Hardening a b s t r a c t An experimental investigation of two potential candidate materials for the diamond die attachment is presented in this framework. These efforts are motivated by the need of developing a power electronic packaging for the diamond chip. The performance of the designed packaging relies particularly ...

The demand for opto-electronics is increasing as we are nearing the future due to the need for high data rate, high bandwidth, lossless transmission and low electromagnetic interference sensitivity. The paper describes the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packa...

Integrated power electronics modules (IPEMs) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment. Integration in power electronics is a rather complex process due to inco...