For solder based flip-chip assembly, the deposition of an under bump metallisation (UBM) layer onto the surface of the AI bondpads of the die is the first step in the wafer bumping process. The UBM is necessary, as the fragile AI pad has a tenacious oxide layer that cannot be soldered without the use of strong fluxes and a barrier layer is required to prevent dissolution of the bondpad into the...

Pemakaian bahan baja karbon rendah ASTM A36 sebagai dasar bangunan konstruksi pipa dan tanki yang dimodifikasi menggunakan proses pelapisan Electroless Ni-P. Proses ini bertujuan untuk meningkatkan sifat-sifat harus dimiliki oleh plat dari ketahanan korosinya. Dengan variasi temperatur kekasaran permukaan serta penambahan perlakuan panas, karakteristik lapisan electroless Ni-P berupa nilai laju...

Brittle solder joints in Electroless Ni electroless Pd immersion Au (ENEPIG) surface finishes are one of the key re­ liability issues in electronics assembly. Previous characterization of the reflow process has indicated that interfa­ cial voids formed after solder reflow are responsible for the decreases in solder joint strength. However, the mechanisms behind the formation of these voids in t...

The Ni-B-P alloy coatings were made autocatalytically (electroless) using an alkaline plating bath with nickel chloride hexahydrate (NiCl2.6H2O) as the source of nickel ions, sodium borohydride (NaBH4) and sodium hypophosphite (NaH2PO2) as reducing agents and source of boron and phosphorous ions, respectively. The effects of bath concentrations on the plating rate, composition of coating, surfa...

Ni-based under-bump metallization (UBM) has attracted wide attention due to its low reaction rate with Sn, compared with Cu and Cu alloy. In this study, the interfacial reactions between eutectic Sn–3.5Ag solder and Ni-based UBM, including electroplated Ni (EP-Ni) and electroless Ni (EL-Ni) are investigated. Morphology and growth kinetics of Ni3Sn4 intermetallic compounds are studied at differe...

The ternary Ni–P–W alloy coating was fabricated by RF magnetron sputtering technique with dual targets of Ni–P/Cu and pure W. Electroplating Ni–P process was introduced to obtain the NiP compound target with extra-high phosphorous contents around 21 at.%. The deposition rate achieved as high as 20 Am/h after modification of the processing parameters. The Ni–P–W coating with a high P/Ni ratio of...

In this work, nickel thin films were deposited on texture silicon by electroless plated deposition. The electroless-deposited Ni layers were characterized by scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive x-ray spectroscopy (EDS), X-ray diffraction analysis (XRD), and sheet resistance measurement. The results indicate that the dominant phase was Ni...

A novel technique for obtaining nonanomalous Ni-Zn-P coatings with high Ni content ~74 wt % as compared to 15-20 wt % in the conventional plating method! has been developed. These coatings show promise as a replacement for Cd in sacrificially protecting steel. Ni-Zn-P coatings were deposited using an electroless method from a solution containing NiSO4 , complexing agent and ammonium chloride. V...

Electroless composite coatings used for achieving of high hardness, lubrication properties, non-stick surface, abrasive coating applications that by impregnation of soft and hard particles into Ni matrix. Electroless Nickel-phosphorous coatings properties and performance is greatly affected by the amount of phosphorus in them. The phosphor in this coating usually varies from 1 to 13 percent. In...

2 Introduction 3 Cell stability 5 Major conclusion concerning stability of cells 11 Electroless-deposited NiTe2 and Ni-P back contacts to p-CdTe 13 Deliverables 14 Suggestions for future work 14 Publications and presentations at major meeting 15 References 16 Figures 17