Modern system engineering is supported by a families of modelling languages; each member of a specific family addresses a different aspect of the application domain. Constructing families of modelling languages is facilitated by the use of packages and templates. Packages are containers of modelling elements. Packages may be specialised and merged. Renamings may be applied to packages. Template...

“Our goal is to find a device and process to screen mail and packages for drugs,” says Dr. Allan Turner, visiting scientist at NIJ’s Office of Science and Technology. “Inmates and others try to introduce drugs through packages, letters, magazines—you name it, they try to slip drugs in it. The process of finding drugs is very labor intensive. We’re looking for a way for technology to make it eas...

With the older “through-hole” technology packages such as the Dual In-line Package (DIP), soldering to printed circuit boards was accomplished using a wave solder. The DIP leads went through holes in the printed circuit board, where they were exposed to molten solder during the mounting process. The DIP’s body was never subjected directly to the solder melt, because it was protected from the he...

As microelectronic devices become more integrated with increased functionality and higher levels of performance, the complexity of packaging technology grows proportionally. Today’s silicon processes have enabled microprocessor designs to achieve very high clock frequencies. As a result of the increase in feature integration, high clock frequencies, and the power supply requirements of the late...

Anisotropic conductive film (ACF) has been used for more than 30 years in flat panel display (FPD) module package. In this paper, the technical trends and development of ACF are described. Among all of them, ACF material design for flexible substrate bonding is critical for the development of flexible display. According to different process flow of flexible AMOLED, flexible substrate bonding te...

We use the GE High Density Interconnect(POL) Technology to create packages for 7x7mm and 3x3mm die in 90nm Radiation Hardened ASICs. We use HDI to “grow” the 7x7mm,3x3mm die to accommodate existing 1.27mm pitch LGA Packages. Next we create 16x16 and 10x10 BGAs with 0.8mm pitch for ultra small size, high acceleration, temperature cycling for

Due to increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in electronic devices, extensive studies on flexible electronic packages have been carried out. However, there has been little research on flexible packages by wafer level package (WLP) technology using anisotropic conductive films (ACFs) and flex substrates, an innovative packaging technology...