The joining of lead-free Sn-3.0Ag-0.5Cu (SAC305) solder alloy to metal substrate with the addition of a porous Cu interlayer was investigated. Two types of porous Cu interlayers, namely 15 ppi—pore per inch (P15) and 25 ppi (P25) were sandwiched in between SAC305/Cu substrate. The soldering process was carried out at soldering time of 60, 180, and 300 s at three temperature levels of 267, 287, ...

Lead-free selective soldering can result in extended times at high temperatures, which in turn can result in excessive dissolution of exposed copper, such as plated through holes. This phenomenon is more severe with lead-free, since the alloys have higher melting points, hence requiring longer times for the PTH to reach the higher temperatures, and the alloys typically have a greater capacity t...

Processing of anodic slimes from an Egyptian copper electrorefining plant, exhibiting high contents of copper, lead, tin and silver has been presented. The proposed hydrometallurgical process consists of two leaching stages for extraction of copper with H2SO4 – O2 and silver with thiourea – Fe. Pyrometallurgical treatment of the leaching solid residue for production of Pb-Sn soldering alloy was...

0026-2714/$ see front matter 2012 Elsevier Ltd. A doi:10.1016/j.microrel.2012.02.018 ⇑ Corresponding author. Tel.: +61 7 3365 1387; fax E-mail address: [email protected] (G. Zeng). The development of lead-free solder alloys for high-temperature applications is required to meet increasing demands for reliable replacements for lead-containing alloys. This paper provides a review of recent research...

Article history: Received 28.3.2013 Received in revised form 26.4.2013 Accepted 29.4.2013 Aluminum matrix composites containing 55% SiC particle reinforcing phase/SiC reinforcement phase particle and Kovar alloy 4J29 were chosen as the base metals. After nickel plating on the surface of SiCp/Al, two kinds of materials were soldered together by using Zn-Cd-Ag-Cu as the filler metal and ZnCl2 as ...

background and aims. in order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. however, these prostheses always fail at their solder joints. the purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. materials and methods. based on ada/iso 9693 specifications...

BACKGROUND AND AIMS In order to fabricate prostheses with high accuracy and durability, soldering techniques have been introduced to clinical dentistry. However, these prostheses always fail at their solder joints. The purpose of this study was to evaluate the effect of gap distance on the tensile strength of base metal solder joints. MATERIALS AND METHODS Based on ADA/ISO 9693 specifications...

JULY 2012 50 High-temperature solder alloys are extensively used in dieattach, power semiconductor, and optical device packaging, flip-chip packaging, etc. Current industry standard solders for these applications are mainly high-lead solders (90–97 wt-% Pb) and gold-based eutectic solder alloys such as the 80Au20Sn solder. The die-attach process involves connecting the silicon die or chips to a...