Here we present digestive ripening facilitated interatomic diffusion for the phase controlled synthesis of homogeneous intermetallic nanocrystals of Au-Sn system. Au and Sn metal nanoparticles synthesized by a solvated metal atom dispersion (SMAD) method are employed as precursors for the fabrication of AuSn and Au5Sn which are Au-rich Au-Sn intermetallic nanocrystals. By optimizing the stoichi...

A comprehensive kinetic analysis was established to investigate the electromigration (EM) enhanced intermetallic compound (IMC) growth and void formation for Sn-based Pb-free solder joints with Cu under bump metallization (UBM). The kinetic model takes into account Cu–Sn interdiffusion and current stressing. Derivation of the diffusion coefficients and the effective charge numbers for the inter...

Abstract: titanium sheets in pure molten aluminum at 750 and X-Ray Diffraction Analysis results, TiAlintermetallic layer thickness increases slowly at primary stages. After that an enhanced growth rate occurs due to layercracking and disruption. Presumably, reaction starts with solving titanium into the molten aluminum causing intitanium super saturation and TiAlintermetallic layer which conseq...

Disposal packages containing high heat generating spent nuclear fuels (SNF) require improved heat transfer to keep the peak cladding temperature from going above the tolerance limit. Filling the accessible void spaces between the container and the SNF with a high heat conducting metal is a potential solution. In metal casting, it is well known that a gap forms at the metal-mold interface due to...

Monodispersed intermetallic AuCu pentagonal nanorods with controlled size and composition have been developed by a seed-mediated growth route. The AuCu/C nanomaterial catalyzed the coupling reaction of sulfonamide with benzyl alcohol in good to excellent yields.

An experiment on the early stages of intermetallic compound layer growth during soldering and its theoretical analysis were conducted with the intent to study the controlling factors of the process. An experimental technique based on fast dipping and pulling of a copper coupon in liquid solder followed by optical microscopy allowed the authors to study the temporal behavior of the sample on a s...

Although the primary driver for the current interest in developing lead-free soldering is global market pressure for more environmentally friendly products, the main concern continues to be lead contamination from end-of-life electronic products in landfill sites. In response to existing and impending legislation in Europe and Japan for the elimination of lead from electronic products, the indu...

In this study, microstructure evolution at intermetallic interfaces in SnAgCu solder joints of an area array component was investigated at various stages of a thermal cycling test. Failure modes of solder joints were analyzed to determine the effects of process conditions on crack propagation. Lead-free printed-circuit-board (PCB) assemblies were carried out using different foot print designs o...