The accurate estimates of values of electromagnetic parameters are essential to determine the final circuit speeds and functionality for designing of highperformance integrated circuits and integrated circuits packaging. In this paper, the quasi-TEM analyses of multilayer coplanar waveguide (CPW) broadside coupled-line balun are successfully demonstrated using Finite Element Method (FEM). We sp...

The impedance measurement technique consists in that the phase-dependent (parametric) inductance of the system is probed by the classical tank circuit via measuring the voltage. The notion of the parametric inductance for the impedance measurement technique is revisited for the case when a quantum system is probed. Measurement of the quantum state of the system of superconducting circuits (qubi...

As interconnect line width and spacing decreases and operating clock rate increases, interconnect has become a bottleneck in developing high-speed integrated circuits, multichip modules, printed circuit boards, and systems. With small line spacing, mutual capacitance and inductance approach the level of self-capacitance and inductance, and can severely degrade signal integrity. The well-known e...

©ALLVIA, Inc. 2011 Sunnyvale, CA www.allvia.com Page 1 Interposers between ICs and package substrates that contain thin film capacitors have been used previously in order to improve circuit performance. However, with the interconnect inductance due to wire bonds being high, the benefits of thin film capacitors have not been fully realized. Replacing the wire bonds with Through Silicon Vias (TSV...

The related issue of the flow of energy in such circuits as described by the Poynting vector is considered in [1]. Supposing the distance d between the centers of the two coils is small compared to the wavelength λ = 2πc/ω, where c is the speed of light in vacuum, circuit analysis is a good approximation. Writing the self inductance of the two coils as Lp = Ls = L and their mutual inductance as...

This paper deals with reliability aspects of Module Integrated Converters (MIC) for grid connected photovoltaic applications. The presented “Low Profile Design” of a MIC has almost twice the power density and a 70% longer lifetime than commercially available MICs. In order to miniaturise and increase the reliability of the MIC all magnetic components have been realised using planar cores and wi...

The characteristics of three phase capacitive input rectifiers which include the effects of transformer leakage inductance have been generated by computer analysis and reduced to a set of design curves. The inclusion of sufficient inductance leads to a three phase commutation mode which in general cannot be accounted ror by a superposition of single phase design curves • The results presented f...