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1 0-7803-5846-5/00/$10.00 © 2000 IEEE Affordability and responsiveness are two key requirements for the next generation of aircraft support systems. Aircraft have to be repaired with minimum downtime and the support process has to be economical and efficient. The vision of Autonomic Logistics (AL) entails a maintenance and support system that can autonomously respond to “events”, e.g. problems ...
In addressing enterprise integration problems, a diversity of technologies such as CORBA and XML were promoted, yet no single integration technology solves all integration problems. As a result, a new generation of software called Enterprise Application Integration (EAI) is emerging to addresses many integration problems by combining a diversity of integration technologies (e.g. message brokers...
The Wilkinson Tests, entry-level tests for assessing the numerical accuracy of statistical computations, have been applied to statistical software packages. Some software developers, having failed these tests, have corrected deficiencies in subsequent versions. Thus these tests have had a meliorative impact on the state of statistical software. These same tests are applied to several econometri...
Assistive technology (AT) can help support the continued independence of people living with dementia, supported by informal carers. Opinions and preferences of informal carers towards a range of assistive and digital information and communication technologies (ICT) to support food purchase and menu selection, including navigation and online shopping, and safe meal-making by individuals living w...
The success of e-Learning is largely dependent on the impact of its multimedia aided learning content on the learner over the hyper media. The e-Learning portals with different proportion of multimedia elements have different impact on the learner, as there is lack of standardization. The Learning Technology System Architecture (LTSA) Layer 1 deals with the effect of environment on the learner....
The demands for electronic packages with lower profile, lighter weight, and higher input/ output (I/O) density have led to rapid expansion in flip chip, chip scale package (CSP) and wafer level packaging (WLP) technologies. The urgent demand high I/O density and good reliability characteristics have led to the evolution of ultra high-density non-solder interconnection, such as wire interconnect...
The increasing demand for feature content of portable electronic products drives requirements for smaller volume and lower cost device packaging. This has, in turn, led to the packaging industry’s interest in stacked chip technology, especially for memory applications. The growth of stacked chip package technology drove development of specific die adhesives that combine low cost with controlled...
Accurate measurement of wood volume is a very important task at each stage of woodworking process beginning with estimation of volume of cut trees and finishing with determining the volume of resulting product. In most cases, current technology of measurement is based on inexact manual procedures and gives rather rough data. To introduce a new measurement technology in woodworking industry 3D i...
SUMMARY mRNA/miRNA-seq technology is becoming the leading technology to globally profile gene expression and elucidate the transcriptional regulation mechanisms in living cells. Although there are many tools available for analyzing RNA-seq data, few of them are available as easy accessible online web tools for processing both mRNA and miRNA data for the RNA-seq based user community. As such, we...
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